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... Chip, Single and double transfer rate. Specification Of MT25QL128ABB8ESF-0AUT Part Number: MT25QL128ABB8ESF-0AUT Series: MT25QL Memory Size: 128 Mbit Interface Type: SPI Maximum Clock Frequency: 133 MHz Org...
Food Grade Heat Seal Chips Aluminum Foil Bags For Nuts Food Packaging Specification: Item: Food Grade Heat Seal Chips Aluminum Foil Bags For Nuts Food Packaging Size & Thickness: Custom based on your requiremen...
...Packaging Co.Ltd Product description Item: Sample Free Customized Logo Food Grade Chips Cookies Bags Fruit Banana Chips Stand Up Zipper Pouch Material: Laminate Material 1. Glossy: PET/VMPET/PE, PET/AL/PE, O...
Integrated Circuit Chip IMBG120R140M1H 1200 V SiC Trench MOSFET Transistors in TO-263-7 package Specification Of IMBG120R140M1H Product Status Active FET Type N-Channel Technology SiCFET (Silicon Carbide) Drain...
...Chips FFSH4065BDN-F085 650V Rectifiers Single Diodes TO-247-3 Through Hole Product Description Of FFSH4065BDN-F085 FFSH4065BDN-F085 is Silicon Carbide (SiC) Schottky Diode – EliteSiC, 40 A, 650 V, D2, packa...
...Chip TO-247-3 Zero Recovery Product Description Of MSC050SDA170B MSC050SDA170B is Zero Recovery Silicon Carbide Schottky Diode, 1700V 136A Through Hole, Package is TO-247-3. Specification Of MSC050SDA170B P...
... - Average Rectified (Io) 49A Speed No Recovery Time > 500mA (Io) Reverse Recovery Time (trr) 0 ns Mounting Type Through Hole Package /...
...a two-lead TO-247 package. Specification Of MSC020SDA120B Part Number MSC020SDA120B Reverse Recovery Time (trr) 0 ns Current - Reverse Leakage @ Vr 200 µA @ 1200 V Capacitance @ Vr, F 1130pF @ 1V, 1MHz Mount...
... Charge: 34 NC @ 20 V Rds On: 225mOhm @ 8A, 20V Drive Voltage: 20V Power Dissipation: 125W Mounting Type:...
.... Specification Of IMZA65R027M1H Part Number IMZA65R027M1H Power Dissipation (Max) 189W (Tc) Operating Temperature -55°C ~ 150°C (TJ) Mounting Type Through Hole Supplier Device Package PG-TO247-4-3 Package /...
...Chip IMW120R220M1H 220mΩ N-Channel Transistors TO-247-3 SiCFET Product Description Of IMW120R220M1H IMW120R220M1H is a 1200 V CoolSiC™ trench-type silicon carbide MOSFET monotube in a TO247-3 package, suita...
... Of AIDK08S65C5ATMA1 Part Number AIDK08S65C5ATMA1 Current - Reverse Leakage @ Vr 50 µA @ 650 V Capacitance @ Vr, F 248pF @ 1V, 1MHz Mounting Type Surface Mount Package / Case TO-263-3,...
... dissipation, and dynamic performance are critical attributes. Specification Of AD9856ASTZ Part Number AD9856ASTZ Function Upconverter Frequency 5MHz ~ 200MHz RF Type HFC Cable Network Features Of...
...Chip 484-FBGA Field Programmable Gate Array Product Description Of EP2C35U484I8 EP2C35U484I8 is Cyclone® II Field Programmable Gate Array (FPGA) IC, package is 484-UBGA (19x19). Specification Of EP2C35U48...
... Of MSC025SMA120S Part Number MSC025SMA120S Operating Temperature -55°C ~ 175°C (TJ) Mounting Type Surface Mount Supplier Device Package D3PAK Features Of MSC025SMA120S Superior avalanche ruggedness RoHS com...
...Chip Product Description Of G846A050210T1HR G846A050210T1HR is Tubes and Wire Housings, Available for Wire-to-Board. Specification Of G846A050210T1HR Part Number G846A050210T1HR Product Category Tubes and W...
...Chips 153-VFBGA Product Description Of IS22TF32G-JCLA2 IS22TF32G-JCLA2 is 16GB eMMC With eMMC 5.1 Interface and TLC NAND, package is 153-VFBGA (11.5x13). Specification Of IS22TF32G-JCLA2 Part Number IS22TF3...
..., either because the densities needed are at the lower GB range, or because the processor does not yet support a UFS interface. Specification Of THGBMUG8C2LBAIL Part Number THGBMUG8C2LBAIL Interface Type:...
...Chip Transceiver Non-Inverting 1 Element 8 Bit per Element 3-State FEATURES OCTAL BIDIRECTIONAL BUS INTERFACE NON-INVERTING 3-STATE OUTPUTS MULTIPLE PACKAGE OPTIONS COMPLIES WITH JEDEC STANDARD NO.7A ESD PRO...
...: Class-D Mounting Style: SMD/SMT Type: 1-Channel Mono Package / Case: SOIC-16 Supply Voltage - Max: 15 V Supply Voltage - Min: 10 V Minimum Operating Temperature: - 40 C Maximum Operating Temperature: + 125...