| Sign In | Join Free | My burrillandco.com |
|
...Chip 18w 25w 2800k 6500k 36-38v For Photograaphy Lamp 1919 COB Product Parameters Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 1919 SERIES 18W+18W 2800K/6500K 120-130 450mA 36-38V...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 200W+200WDual Color Temperature 2700K/6500K 90/120 4.6A 42-45V 40X55MM 34MM 120 95 Mirror copper-alum...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 200W+200WDual Color Temperature 2700K/6500K 90/120 4.6A 42-45V 40X55MM 34MM 120 95 Mirror copper-alum...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
... SUBSTRATE 2424SERIES 40W+40W Bi Color LED Chip 2800K/6500K 100/110 1100MA 36V-38V 24X24MM 21MM 120 95 Mirror copper-aluminum combined substrate Two-color COB (Chip-on-Board) LED lamps have many advantages, ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...