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Total 2824 products for component failure analysis Manufacture & Suppliers

Full-angle Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100

...chip production analysis with full-angle rotary detection capabilities. Applications SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor and Packaging components Battery Industry and Electronic components ...

Unicomp Technology
Guangdong,China

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PCBA Through-hole Capacitor UNICOMP AX9100VS X-ray Machine Offline SMT PCBA Quality Inspection Equipment

... semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip inspection Automotive Components and New Energy Industry Aluminum Die Casting and Molded...

Unicomp Technology
Guangdong,China

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Clear Inner Structure Scanning Mouse Scroll Wheel Defect Inspection X-ray AX9100max Unicomp

...components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and sem...

Unicomp Technology
Guangdong,China

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High Resolution 3D CT Imaging For PCBA PTH Capacitor UNICOMP AX9100VS X-ray Inspection

... semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip inspection Automotive Components and New Energy Industry Aluminum Die Casting and Molded...

Unicomp Technology
Guangdong,China

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Real-Time Radiation Safety Monitoring BGA AX8300MAX UNICOMP Fingerprint Recognition Login

... of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications Quality verification of semiconductor packaging devices including BGA, CSP, LED...

Unicomp Technology
Guangdong,China

Verified Supplier

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Clear Inner Structure Scanning Mouse Scroll Wheel Defect Inspection X-ray AX9100max Unicomp

... non-destructive inspection across extensive industrial and semiconductor applications. Applications Covers BGA, CSP, flip chips, LED packaging components, fuses,...

Unicomp Technology
Guangdong,China

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High Accuracy X-ray Inspection for Dosimeter Fault AX9100max Unicomp Non-destructive Testing Device

...components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and sem...

Unicomp Technology
Guangdong,China

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Inner Defect Scanning & Positioning Water Heater Heating Element Fault Inspection X-ray AX9100max Unicomp

...components and bonding wire analysis with high precision non-destructive testing capabilities. Applications This system is widely deployed for high-precision non-destructive inspection across extensive indus...

Unicomp Technology
Guangdong,China

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Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution

...analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications Quality verification of semiconductor packaging devices including BGA, ...

Unicomp Technology
Guangdong,China

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IC BGA CSP QFN Packaging Inspection X-ray AX8300MAX UNICOMP 4K Flat Panel Detector

...analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification...

Unicomp Technology
Guangdong,China

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Intelligent Multi-view X-ray UNICOMP AX9100VS Head-in-Pillow Effect Solder Ball Crack Detection

... in Head-in-Pillow Effect and Solder Ball Crack Detection. Applications BGA, CSP, LED, Flip Chip inspection Automotive Components and New Energy Industry Aluminum Die Casting and Molded Plastic components Ce...

Unicomp Technology
Guangdong,China

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AI Automatic Measurement 3D CT Layer Scanning UNICOMP AX9100VS Void Rate Head-in-Pillow Defect Inspection

... and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip inspection Automotive Components and New Energy Industry Aluminum Die Casting and Molded Plastic compo...

Unicomp Technology
Guangdong,China

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110kV Sealed X‑ray Tube X‑ray Inspection Machine AX8300MAX Unicomp BGA Void Volume Measurement Equipment

...analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications Quality verification of semiconductor packaging devices including BGA, ...

Unicomp Technology
Guangdong,China

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360° Horizontal Rotary Table SMT High‑Density BGA X‑ray Inspection Machine AX8300MAX Unicomp

...density BGA, semiconductor, and industrial component analysis with 360° horizontal rotary table capability. Applications BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die ...

Unicomp Technology
Guangdong,China

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AI Super‑Resolution Reconstruction UNICOMP AX9100MAX CE FDA Certified SMT Solder Void Defect Detector

...-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses,...

Unicomp Technology
Guangdong,China

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Flat‑Panel Detector Worktable PCB Assembly BGA AX8300MAX Unicomp Cold Solder Joint Scanner

...analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification...

Unicomp Technology
Guangdong,China

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110kV Xray machine Unicomp AX8300MAX for PCB&BGA micron defects inspection and voids measurement

...analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification...

Unicomp Technology
Guangdong,China

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High accuracy NDT X-ray machine Unicomp UNC160 used for electric cars battery housing

... various industrial components. Specializes in detecting casting part cracks and porosity with exceptional precision. Applications Cast parts and pressure vessels inspection Epoxy resin defect detection Whee...

Unicomp Technology
Guangdong,China

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High resolution digital X-ray Unicomp AX9100Max for ADSL splitter PCBA solder void internal defect detection

...analysis in electronic components with high precision non-destructive testing capabilities. Applications This system is widely deployed for high-precision non-destructive inspection across extensive industri...

Unicomp Technology
Guangdong,China

Verified Supplier

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110kV offline Xray machine Unicomp AX8300MAX for PCB&BGA voids measurement and micron defects inspection

...analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification...

Unicomp Technology
Guangdong,China

Verified Supplier

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Component Failure Analysis

Total 2824 products for component failure analysis Manufacture & Suppliers