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Copper Alloy Steel ASTM B111 C68700 Heat Exchanger Tube , Cooling Systems The ASTM B111 C68700 copper alloy steel heat exchanger tube is a seamless tube made from a copper-nickel alloy (70% Cu, 30% Ni). This al...
...Copper Alloy Plates With Corrosion Resistance Sanhui Tungsten Copper Alloy Plate Advantages: The excellent metal properties of high-purity tungsten powder and the plasticity and high conductivity of high-pur...
...Copper Alloy Plates With Corrosion Resistance Sanhui Tungsten Copper Alloy Plate Advantages: The excellent metal properties of high-purity tungsten powder and the plasticity and high conductivity of high-pur...
...Copper Spot Welding Electrode 1. The Tungsten Copper Spot Welding Electrode's description: The tungsten copper alloy is ideal for welding electrodes because it is simple to process, has excellent temperature...
...Copper Alloy Sheet For Construction Product Discription Copper sheet and copper plate find use in a huge array of applications. One of few metals that doesn’t need to be extracted from ore (i.e., it is direc...
...Copper Alloy Heat Sink For MoCu Substrates In Laser Microwave Ceramic-Metal Packages 1. Information Of MoCu Alloy Heat Sink For MoCu Substrates: Molybdenum-copper heat sink is a high-performance heat dissipa...
... composed of tungsten and copper. Tungsten copper alloy electrode combines the good properties of tungsten and copper, high temperature resistance, arc ablation resistance, high strength, high specific gravi...
.... This effect is like calendering again, which makes the material harder and stronger, and increases the conductivity and elongation at the same time. Standard: DIN EN ASTM JIS CuNi3SiMg CuNi3SiMg C70250 C70...
... thermal expansion and high electrical or thermal conductivity. (2)/ Tungsten copper alloy is used to make engines and electrical devices. It is also used in the fields of aviation and spaceflight. Electrode...
...Copper Alloy High Voltage Discharge Tubes 1. Tungsten Copper Alloy High Voltage Discharge Tube Electrodes Specifications: The temperature of the contact material will rise by several thousand degrees Celsius...
...Copper Pipes Seamless Copper Tube TUBE C70600 C71500 C12200 Alloy Copper Nickel Tube Copper tube is also known as purple copper tube. A type of non-ferrous metal tube, it is a pressed and drawn seamless tube...
... has both the low expansion characteristics of tungsten and the high thermal conductivity of copper. The thermal expansion coefficient and thermal conductivity of tungsten and copper can be adjusted with the...
.... Tungsten alloy: we can produce kinds of specification(WNiFe,WNiCu and Tungsten Carbide Alloy) Density g/cm3 TRS N/ mm2 Elogation % Elastic modulus kgf/ mm2 HRC 16.8-18.5 650-950 3-16 ......
.... Tungsten alloy: we can produce kinds of specification(WNiFe,WNiCu and Tungsten Carbide Alloy) Density g/cm3 TRS N/ mm2 Elogation % Elastic modulus kgf/ mm2 HRC 16.8-18.5 650-950 3-16 ......
.... Tungsten alloy: we can produce kinds of specification(WNiFe,WNiCu and Tungsten Carbide Alloy) Density g/cm3 TRS N/ mm2 Elogation % Elastic modulus kgf/ mm2 HRC 16.8-18.5 650-950 3-16 ......
.... Tungsten alloy: we can produce kinds of specification(WNiFe,WNiCu and Tungsten Carbide Alloy) Density g/cm3 TRS N/ mm2 Elogation % Elastic modulus kgf/ mm2 HRC 16.8-18.5 650-950 3-16 ......
...Copper Alloys Rod / Wire / Strip Material:C18150,C18200,C15000 Feature: High strength:Tensile strength> 450Mpa High hardness:HRB70-86 HB120-165 High conductivity:Conductivity> 75% High softening point:475-6...
...Copper Molybdenum Copper Alloy Substrate For Glass Adapter Plate Microelectronic Packaging 1. Information Of Cu/MoCu30/Cu CPC 1:4:1 Substrate For Microelectronic Packaging: Copper has high thermal and electr...
...a metal material that uses a molybdenum-copper substrate as a base material and covers a uniform nickel layer on the surface of the molybdenum-copper substrate by electroplating a nickel layer. This substrat...
...Copper Alloy Heat Sink Based Sheet For Microelectronics Packaging 1. Introdution Of Thickness 1.5mm MoCu Heat Sink Sheet: Molybdenum copper substrate is a material widely used in the field of microelectronic...