| Sign In | Join Free | My burrillandco.com |
|
High Power Zipper Fin Heat Sink With Copper Tubes For Telecom Quick Detail: Material : Aluminum alloy , copper tube MOQ: Samples or small orders acceptable Flatness : 0.......
Fine Particle Size Thermal Uniform MoCu Heat Sinks For RF And Microwave (GAAS) Circuits Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansi...
90WCu / Tungsten Copper 90 / 10 Heat Sink For Electronic Packaging Description: Electronic packaging is to put a certain function of the integrated circuit chips (including semiconductor integrated circuit chip...
WCu Material / Tungsten Copper Heat Sink Nickel Plated For Laser Diode Submounts Description: It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigne...
Tailored Thermal Expansion Critical Dimensional Tolerance MoCu Heat Sinks For Airborne/Satellite Radar Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable ...
CuW Sub - Mounts CuW10/90 Heat Sink Tungsten Copper Laser Diode Packaging Description: They are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal ex...
Nickel Plated 70MoCu Electronic Packaging Materials And Heat Sink For RF / MV Packages Description: It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the com...
Molybdenum Copper MoCu CuMo Heat Sinks For Electric Vehicles Description: MoCu alloy is a kind of pseudo-alloy that is composed of Molybdenum and copper. It consists of both the characteristics of molybdenum an...
0.05T Mo80Cu20 Moly / Copper Heat Sink Material For Radio Frequency Industry Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable coefficient of thermal ......
0.05 Thickness Moly / Copper Heat Sink Material For Automobile Industry Description: Zhuzhou Jiabang Refractory Metal Co. Ltd. is a premier manufacturer of the high performance thermal packaging solutions with ...
Copper Molybdenum (Cu-Mo) Heat Sink Composite Materials Description: MoCu alloy heatsink is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But ...
Heat Sink Molybdenum Copper Electronic Packing Material Description: MoCu alloy heatsink is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But ...
Cu / Mo70Cu / Cu (CPC) Heat Sinks and Shims For High Power Device Description: Cu/Mo70Cu/Cu is a sandwich composite similar to that of Cu/Mo/Cu with a Mo70-Cu alloy core layer and two copper clad layers. The ra...
White High Temperature Resistance Certificated Heat Sink Thermal Grease For GPU Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and Thermally Conductive Filler Mixture - Color White Visual D...
Non-Vulcanized Silicone Oil And Thermally Conductive Filler Mixture Heat Sink Thermal Grease Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and Thermally Conductive Filler Mixture - Color W...
1.0W/m.K Non-Vulcanized Silicone Oil Silver Gray Heat Sink Thermal Grease Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and Thermally Conductive Filler Mixture - ......
1.0 W/m.K Heat Sink Thermal Grease Thermally Conductive Filler Mixture Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and ......
Low Thermal Resistance Grey Heat Sink Thermal Grease With Non-Vulcanized Silicone Oil Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and ......
1.0W/m.K Thermal Conductivity Slicone Heat Sink Thermal Grease For LED Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and Thermally Conductive Filler ......
Aluminum 6061 Liquid Heat Sink High-efficiency cooling solution designed to maintain optimal operating temperatures for electronic components and systems. Engineered with precision from premium materials for ex...