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...CPU: I3/I5, Atom525,Celeron J1800/1900 RAM: 2GB DDR3/4GB DDR3/8GB DDR3 SSD: 32GB/64GB/128GB/256GB Touch Screen: Resistive/Compacitive Card Reader: Yes/No Windows POS System Main Features 1. Grade A LCD Displ...
RK3399 Core Board PCBA Six-Core High-Performance CPU YT-12 Characteristics: The size is 55mm*55mm, which guarantees the compact volume and enough GPIO interfaces; Use RK's own RK808 PMU to ensure stable and rel...
Full Automatic CT PTTesting Equipment With High Performance CPU Easy Operation 2. Equipment Description: HYVA-402 can finish: CT/PT volt-ampere characteristic curve test, CT/......
...e a much more rich experience for Hisilicon chips. 1. Based on the Linux Ubuntu system With the IMX307 sensor, better image performance. 2. Supports the MQTT protocol for the cloud integration server. 3. Wit...
Product Description: STM32F767ZIT6 MCU High-performance & DSP FPU, Arm Cortex-M7 MCU 2 Mbytes of Flash 216 MHz CPU Our Electronic IC Chip is a buck switching regulator IC integrated circuit chip, commonly used ...
RK3399 Core Board PCBA Six-Core High-Performance CPU YT-12 Characteristics: The size is 55mm*55mm, which guarantees the compact volume and enough GPIO interfaces; Use RK's own RK808 PMU to ensure stable and rel...
... RX3i Central Processing Module Technical Application The PACSystems* RX3i CPU can be used to perform real time control of machines, processes, and material handling systems. The CPU communicates with the pr...
TIF100C 3030-11 Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory Product descriptions TS-TIF100C 3030-11 series is a silicone-based thermal material designed to fil...
TIF100-06U Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling Product descriptions TlF100-06U series thermally conductive interface materials are applied to fill the air gaps bet...
TIF100 6520-11 High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad Product descriptions TIF®100 6520-11 series of thermal interface materials is ......
TIF500-30-11US High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors Product descriptions TIF500-30-11US Series is an ultra-soft thermal interface mat...
TIF700NU Good Insulation Performance Ultra-Soft 6.5W Thermally Gap Pad For AI Server Computer CPU GPU Cooling Product descriptions TIF700NU Series is an ultra-soft thermal interface material designed specific...
... 6) LPDDR4X+UFS high performance memory chip 1.3 million BSI light-sensitive scanning engine Industrial grade infrared thermal imaging, temperature measurement, ......
...CPU*1+DIMM*48GB+SSD*1 The USN9810 uses the Advanced Telecom Computing Architecture (ATCA) platform and features large capacity and high integration, easy operation and maintenance, high reliability, flexibil...
...CPU*1+DIMM*48GB+SSD*1 The USN9810 uses the Advanced Telecom Computing Architecture (ATCA) platform and features large capacity and high integration, easy operation and maintenance, high reliability, flexibil...
...plates, offering superior performance in terms of heat dissipation. The copper pipe heatsink is customized with the shape and size you need, and it can effectively reduce the operating temperature of your co...
... to delivery Welcome to contact for more details! Hitachi ARIETTA V60 Ultrasound System: Superior Imaging Performance for Advanced Ultrasound. The Hitachi ARIETTA V60 ultrasound system represents a pinnacle ...