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Total 2134 products for cpu thermal compound Manufacture & Suppliers

Customized Industrial Silicone Gel Material Potting Glue Compound 2 Part

...Compound 2 Parts Flexible Potting Adhesive Waterproof 1:1 For Electronics PCB Lights Controller PRODUCT DESCRIPTION of Silicone Potting Glue HN-8806, two-component addition type silicone potting rubber which...

Shenzhen Hanast New Material co.,LTD
Guangdong,China

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Industrial Electronic Thermally Conductive Silicone Potting Compound Gel High Temp

High Temp Potting Compound 1:1 Electronic Potting Silicone Rubber For Automotive Electronics Moisture-Proof Electrical Insulation Inverter Sensor Power Module Battery Silicone Glue Product Description: Two-comp...

Shenzhen Hanast New Material co.,LTD
Guangdong,China

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Low Viscosity RTV Potting Compound Silicone Gel For Electronics PCB LED Power Supply

Low Viscosity RTV Silicone Potting Compound For Electronics PCB LED Power Supply Battery Inverter Thermal Conductive Potting Glue High Temp Product application: This product is widely used in the potting and se...

Shenzhen Hanast New Material co.,LTD
Guangdong,China

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Thermally Conductive Black Potting Compound Epoxy Resin Glue Material Low Viscosity

Transparent Epoxy Resin Potting Glue 2 Parts Silicone Potting Glue Compound 2:1 Low Viscosity For Resistors Sensors Temperature Controllers High Hardness Epoxy Potting Material Product model of Epoxy Resin Pott...

Shenzhen Hanast New Material co.,LTD
Guangdong,China

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TIF700Z Heat Resistant 7W/MK Thermal Pads For Laptop Heatsink CPU GPU LED Cooler

TIF®700Z Heat Resistant 7W/MK Thermal Pads For Laptop Heatsink CPU GPU LED Cooler Product descriptions TlF®700Z is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the ......

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF700QE Silicone 8.0W Thermal Pad For CPU GPU For Various Strict Application Fields

TIF700QE Silicone 8.0W Thermal Pad For CPU GPU For Various Strict Application Fields Product descriptions TlF700QE is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the hea...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF100-02S Termal Pad 1.5W 1mm 2mm 3mm 5mm Cooling Silicone Thermal Conductive Pads For CPU LED Laptop

TIF��100-02S Termal Pad 1.5W 1mm 2mm 3mm 5mm Cooling Silicone Thermal Conductive Pads For CPU LED Laptop Product descriptions TlF��100-02S Series is recommended for applications that require a minimum amount of p...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF100-11U Heat Resistant 1.5W Silicone Thermal Pads For Laptop Heatsink CPU GPU SSD IC LED Cooler

TIF100-11U Heat Resistant 1.5W Silicone Thermal Pads For Laptop Heatsink CPU GPU SSD IC LED Cooler Product descriptions TlFTM100-11U Series is not only designed to take advantage of the gap heat transfer, to fi...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF100 12055-62 Custom 12W/Mk Silicone Conductive Soft Gpu Cpu Termal Pad

...Cpu Termal Pad Product descriptions TIF®12055-62 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offe...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF700RES High Temperature 8.5W Custom Silicone Gap Filler Electric Thermal Pads for Gpu Cpu Led

TIF700RES High Temperature 8.5W Custom Silicone Gap Filler Electric Thermal Pads for Gpu Cpu Led Product descriptions TIF®700RES Series thermally conductive interface materials are applied to fill the air gaps ...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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Semiconductor Automated Test Equipment Thermal Gap Filler 1.5 W/MK

...Thermal Gap Filler For CPU Heatsink Cooling The TIF100-15-07E use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to b...

Dongguan Ziitek Electronic Materials & Technology Ltd.
Guangdong,China

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Good Softness And Fillability Thermally Conductive Gap Filler Pads For Automotive Electronics AI Processors

...Thermally Conductive Gap Filler Pads For Automotive Electronics AI Processors Products Description TIF®200-15-27E Series is a compound thermal interface material that combines good thermal conductivity, reli...

Dongguan Ziitek Electronical Material and Technology Ltd.
Guangdong,China

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0113 Thermal Conductive Grease 2.1W/m·K Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal

0113 TDS-EN.pdf 0113 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components. Product Features: One-component, white; Physical form: p...

Shanghai Huitian New Material Co., Ltd
Shanghai

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High Performance Super Soft Cooling Pad for Laptop GPU CPU

High Performance Super Soft Cooling Pad for Laptop GPU CPU Company Profile With professional R&D capabilities and over 18 year experiences in thermal interface material industry, Ziitek company own many unique ...

Dongguan Ziitek Electronical Material and Technology Ltd.
Guangdong,China

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Fire Rating 94 V0 High Tack Surface Thermal Gap Filler Pad For CPU

Fire Rating 94 V0 High Tack Surface Reduces Contact Resistance for CPU The TIF120N-50-10F is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heatin...

Dongguan Ziitek Electronic Materials & Technology Ltd.
Guangdong,China

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Perfluoro Kalrez O Rings Perfluoroelastomer FFKM Compound

Dowhon Perfluoro Kalrez O Ring Perfluoroelastomer Ffkm Compound Colored For O Rings High Temperature Thermal Resistance Product Description FFKM is a high-performance rubber material, also known as , which is a...

Sichuan Dowhon International Co., Ltd.
China

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High-Efficiency Double Roller Extrusion Granulator For Dry Compound Fertilizer Production Binder-Free Granulation Technology

...granulator is an advanced dry compaction system designed specifically for producing high-quality compound fertilizer granules without liquid binders or thermal drying. Utilizing German-engineered hydraulic t...

ZHENGZHOU SHENGHONG HEAVY INDUSTRY TECHNOLOGY CO., LTD.
Henan,China

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Momentive YG6111 Semiconductor Thermal Joint Dielectric Compound

...Thermal Joint Dielectric Compound Basic Properties Property Unit Value Appearance White Specific Gravity (25°C) 2.45 Penetration (JIS K 2220) 310 Thermal Conductivity W/m·K 0.84 Dielectric Constant (60Hz) 5....

Shenzhen Huazhisheng New Material Technology Co., Ltd.
Guangdong,China

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Semi-insulating SiC on Si Compound Wafer 4H-SEMI substrate P type N type Thickness 500um

...Compound Wafer , Si wafer, Silicon Wafer, Compound Wafer, SiC on Si Compound Substrate, Silicon Carbide Substrate, P Grade, D Grade, 4inch, 6inch, 4H-SEMI About Compound wafer use SiC on Si compound wafer to...

SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai,China

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Cpu Thermal Compound

Total 2134 products for cpu thermal compound Manufacture & Suppliers

Customized Industrial Silicone Gel Material Potting Glue Compound 2 Part

Industrial Electronic Thermally Conductive Silicone Potting Compound Gel High Temp

Low Viscosity RTV Potting Compound Silicone Gel For Electronics PCB LED Power Supply

Thermally Conductive Black Potting Compound Epoxy Resin Glue Material Low Viscosity

TIF700Z Heat Resistant 7W/MK Thermal Pads For Laptop Heatsink CPU GPU LED Cooler

TIF700QE Silicone 8.0W Thermal Pad For CPU GPU For Various Strict Application Fields

TIF100-02S Termal Pad 1.5W 1mm 2mm 3mm 5mm Cooling Silicone Thermal Conductive Pads For CPU LED Laptop

TIF100-11U Heat Resistant 1.5W Silicone Thermal Pads For Laptop Heatsink CPU GPU SSD IC LED Cooler

TIF100 12055-62 Custom 12W/Mk Silicone Conductive Soft Gpu Cpu Termal Pad

TIF700RES High Temperature 8.5W Custom Silicone Gap Filler Electric Thermal Pads for Gpu Cpu Led

Semiconductor Automated Test Equipment Thermal Gap Filler 1.5 W/MK

Good Softness And Fillability Thermally Conductive Gap Filler Pads For Automotive Electronics AI Processors

0113 Thermal Conductive Grease 2.1W/m·K Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal

High Performance Super Soft Cooling Pad for Laptop GPU CPU

Fire Rating 94 V0 High Tack Surface Thermal Gap Filler Pad For CPU

Perfluoro Kalrez O Rings Perfluoroelastomer FFKM Compound

High-Efficiency Double Roller Extrusion Granulator For Dry Compound Fertilizer Production Binder-Free Granulation Technology

Momentive YG6111 Semiconductor Thermal Joint Dielectric Compound

Semi-insulating SiC on Si Compound Wafer 4H-SEMI substrate P type N type Thickness 500um