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Available in varies thicknesses Outstanding thermal performance silicone sheets for LED Controller ,1.5mmT Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point t...
Easy release construction thermal pad for Audio and video components ,5.0mmT Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, th...
Thermal Grease CPU Thermal Paste Low Thermal Resistance Environmentally Friendly Silicon Paste Customization TIG™780-25 is environmentally safe silicone-based thermal grease designed to solve overheating and re...
thermally conductive potting compound 60-120min Operating Time Flame Retardant UL94 V-0 Thermal Conductive Potting Compound for Performance Product Description: The Thermally Conductive Potting Compound is a hi...
...Compound | HN-8820 A/B | RTV Addition Cure Product Overview for Thermally Conductive Potting Compound: HN-8820 A/B is a low-viscosity, RTV addition-type silicone potting material with 2.0 W/m·K thermal condu...
...Thermal Conductivity Compound For Electronics Two Components Silicone Electronic Control Modules Sensor Product Overview for Thermally Conductive Potting Compound: RTV 2 Addition potting compound HN-8830A/B ...
...Compound | HN-8820 | 2.0 W/m·K | Waterproof & Anti-Aging Product Overview for Thermally Conductive Potting Compound: Protect your electronics with HN-8820, a waterproof and anti-aging potting compound with 2...
Thermal Conductive Silicone For Electronics High Thermal Conductivity 2.0w/M·K Silicone Potting Compound Potting Factory Direct Supply Product Overview for Thermally Conductive Potting Compound: HN-8820 is a tw...
3.0W/mK high cost-effective silicone pads for power supply blue color Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal c...
Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components TIF®700NUS series of thermal interface materials is specficlly designed to fill air gaps between hea...
...CPU And GPU The TIC™800K Series products is a high thermal conduction and dielectric performance insulator pad consisting of a ceramic filled low melting point compound coated on MT Kapton film. At 50℃,TIC™8...
...Compound 2.8W/m-K Thermal Conductive Putting Compound For LED and Power Drive Potting Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and process...
... product specially designed for various electronic applications requiring excellent thermal conductivity and electrical insulation properties. This advanced potting compound is ideal for use in electric cont...
...Thermally Conductive Potting Compound is a high-performance product designed for applications requiring excellent thermal conductivity and flame retardancy. With a mix ratio of 1:1, this potting compound is ...
... gel offering high thermal conductivity (2.0 W/m·K) and superior electrical insulation. With a 1:1 mix ratio and easy processing, it provides reliable protection for electronics operating in harsh environmen...
3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal co...
...CPU Thermal Pad is designed with a hardness of Shore 30±5, providing high thermal conductivity and excellent compression properties. It boasts a tensile strength of 0.23MPa, which ensures that it can withsta...
...Thermally Conductive Potting Compound, a high thermal conductivity potting gel with a thermal conductivity of 2.0±0.1 W/M▪K. This electrically insulating thermal potting material is designed to meet the dema...
White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable,lon...
.... It is a chemical-resistant thermal encapsulation adhesive that meets the stringent requirements of GB/T 31838.2-2019 with a volume resistivity of 5.0×10^14 Ω·cm. This potting compound is available in three...