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Wonder X3931 PVC Fine Line Masking Adhesive Tape Blue Color High Temp Retardant Rubber Base Description: 1. Precision Masking: PVC fine line masking tape is specifically designed for precision masking applicati...
...adhesive tape Type # 6361 Base cloth: Imported E-glass cloth Adhesive: Silicone adhesive Coating: Single side coated Charactor: 1. Stable during long time heating. Long time working temperature: 180°C,short ...
...adhesive tape Type # 6361 Base cloth: Imported E-glass cloth Adhesive: Silicone adhesive Coating: Single side coated Charactor: 1. Stable during long time heating. Long time working temperature: 180°C,short ...
...Adhesive Tape PRODUCT DESCRIPTION A 50 micron (2.0 mil) high tensile strength aluminum foil backing, combined with water-based acrylic adhesive, protected by an easy-release silicone release paper. FEATURES ...
...Adhesive Tape Sealing Edge Fire Proof Anti-Rush Anti-Corrosion Function PRODUCT DESCRIPTION A 50 micron (2.0 mil) high tensile strength aluminum foil backing, combined with a high performance synthetic rubbe...
...Adhesive Tape for Heavy Duty Item Description It is made of soft or rigid PVC film as the substrate, coated with hot-melt pressure-sensitive adhesive on both sides, and covered with double-sided laminated si...
Product Description: Die Cut Adhesive Tape is a high-performance solution for a variety of applications. It has excellent adhesion, with high, medium, or low adhesion depending on the type of material. It can b...
...adhesive tape Product features/Applications: Ultra-thin bonding effect can still ensure good. Aging resistance and UV light performance is good, more generation fog. Widely used in LCD and fixed nameplate; P...
0.8 w/mk White thermal adhesive tape for led fluorescent lamp The TIA™806 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type...
Double Sided Thermal Adhesive Tape for Heatsink The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive...
... Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semicond...
... Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA™808FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semicon...
... power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and ...
... power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and ...
...power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and m...
... power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and ...
... Thermal Adhesive Tape 1.2 W/mK For Led Fluorescent Lamp 0.1~0.5mmT The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors...
... semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing....
... thermal adhesive double side tape fire resistance equate 94 V-0 The TIA™605P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. T...
... adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumpt...