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Total 1238 products for dicing silicon wafer Manufacture & Suppliers

HPSI High Purity Semi-insulating SiC Wafers 2"3"4"6" 8" Prime/Dummy/Research Grade

... for high-frequency, high-power, and high-temperature applications. Available in 2-inch, 3-inch, 4-inch, 6-inch, and 8-inch diameters, these wafers are offered in Prime (production-grade), Dummy (process-tes...

SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai,China

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Customized SiC Ceramic End Effector For Wafer Handling

...Wafer Handling The Silicon Carbide (SiC) Ceramic End Effector is a high-performance wafer handling tool designed for semiconductor manufacturing, photovoltaic production, and advanced electronics assembly. U...

SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai,China

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Customized SiC Ceramic Boat Carrier For Wafer Handling

... manufacturing processes. Engineered for high-temperature stability, chemical resistance, and ultra-low contamination, this carrier ensures safe and efficient wafer transport in demanding environments such a...

SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai,China

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6inch SiC Epitaxial Wafer Diameter 150mm 4H-N Type 4H-P Type For 5G Communication

... summary of 6inch SiC epitaxial wafer 6inch SiC Epitaxial Wafer Diameter 150mm N type P type for 5G Communication As a core material for silicon carbide (SiC) power device manufacturing, the 6-inch 4H-SiC ep...

SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai,China

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HPSI SiC Wafer 2-12 Inch Optical Grade for AI/AR Glasses

��HPSI SiC Wafer Overview ��HPSI SiC Wafer 2-12 Inch Optical Grade for AI/AR Glasses�� HPSI-type SiC wafers (High-Purity Semi-Insulating Silicon Carbide) serve as core optical materials in AI and AR glasses. Wi...

SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai,China

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HPSI High Purity Semi-insulating SiC Wafers 2"3"4"6" 8" Prime/Dummy/Research Grade

Product Description HPSI SiC Wafer Overview HPSI SiC Wafer: 2 - 12 Inch Optical Grade for AI/AR Glasses HPSI-type SiC wafers (High-Purity Semi-Insulating Silicon Carbide) are pivotal optical materials in AI and...

SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai,China

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8-12 Inch Glass Wafer Substrates for Semiconductor and Advanced Packaging Applications

...h conventional silicon substrates, glass wafers offer excellent electrical insulation, low dielectric loss, superior dimensional stability, and outstanding optical transparency. Our 8-inch, 10-inch, and 12-i...

SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai,China

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4h-N 100um Silicon Carbide Abrasive Powder For SIC Crystal Growth

high purity 99.9995% sic powder for 4H-N and un-doped 4h-semi sic crystal growth About Silicon Carbide (SiC)Crystal Application of SiC SiC crystal is an important wide-bandgap semiconductor material. Because of...

SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai,China

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Silicon Carbide Mirror (SiC Mirror) – High-Precision Lightweight Optical Components

Product Introduction The Silicon Carbide (SiC) Mirror is a high-performance optical component designed for applications that require exceptional rigidity, thermal stability, and optical precision. Fabricated fr...

SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai,China

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Φ100mm 0.5mm Single Crystal Quartz Wafer X-cut Y-cut for Pressure Sensor

��100mm 0.5mm Thick Single Crystal Quartz Wafer X-cut Y-cut for Pressure Sensor Quartz is a crystalline form of silicon dioxide (SiO2). It is a hard, brittle, transparent material with a density of 2649 kg/m3 an...

Hangzhou Freqcontrol Electronic Technology Ltd.
Shanghai,China

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Diamond Back Grinding Wheel For Silicon Sapphire Wafers Cut Glass Dremel Diamond Wheel

Diamond Back Grinding Wheel for Silicon Sapphire Wafers cut glass dremel diamond wheel Product Description Name Diamond Back Grinding Wheel for Silicon Sapphire Wafers cut glass dremel diamond wheel Bond Vitrif...

SIGNI INDUSTRIAL (SHANGHAI) CO., LTD
China

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High End Wafer Dicing Saw Gallium Phosphide With Adjustable Blade Strength

Electroplated bond diamond blades Hub Blade with Hub HT-YB series The HT-YB series diamond abrasive blade is one specific type of electroplated hub dicing blades we supply. It is a high-end diamond cutting tool...

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
Henan,China

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Stable Operation Disco Diamond Blade , Electroplated Ceramic Wafer Saw Blade

Electroplated bond diamond blades Hub Blade with Hub HT-YH series The HT-YH hub dicing blade was independently developed by Hongtuo using international advanced technology. The diamond cutting blade can effecti...

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
Henan,China

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Cutting Saw Hub Blade Customized Grit Size Ceramic Wafers Composite Plates

Electroplated bond diamond blades Hub Blade with Hub HT-YH series The HT-YH hub dicing blade was independently developed by Hongtuo using international advanced technology. The diamond cutting blade can effecti...

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
Henan,China

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Tolerance +0.02~ 0 Dicing Saw Blade Durable For Cutting Brittle Quartz Glass

Resin bond daimond dicing Blade for wafer semicoductor,ceramic chips Hongtuo��s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting res...

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
Henan,China

Active Member

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High End Wafer Dicing Saw Gallium Phosphide With Adjustable Blade Strength

Electroplated bond diamond blades Hub Blade with Hub HT-YB series The HT-YB series diamond abrasive blade is one specific type of electroplated hub dicing blades we supply. It is a high-end diamond cutting tool...

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
Henan,China

Verified Supplier

Add to cart
Cutting Saw Hub Blade Customized Grit Size Ceramic Wafers Composite Plates

Electroplated bond diamond blades Hub Blade with Hub HT-YH series The HT-YH hub dicing blade was independently developed by Hongtuo using international advanced technology. The diamond cutting blade can effecti...

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
Henan,China

Verified Supplier

Add to cart
Stable Operation Disco Diamond Blade , Electroplated Ceramic Wafer Saw Blade

Electroplated bond diamond blades Hub Blade with Hub HT-YH series The HT-YH hub dicing blade was independently developed by Hongtuo using international advanced technology. The diamond cutting blade can effecti...

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
Henan,China

Verified Supplier

Add to cart
Tolerance +0.02~ 0 Dicing Saw Blade Durable For Cutting Brittle Quartz Glass

Resin bond daimond dicing Blade for wafer semicoductor,ceramic chips Hongtuo��s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting res...

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
Henan,China

Verified Supplier

Add to cart
Trinocular Large Circuit Wafer Metallurgical Optical Microscope Extra Wide Field NCM-J1600

... with reflected and transmitted light, which are used for a variety of specialty applications such as semiconductor silicon wafer manufacturing, inspection and quality control like inspection of grain size, ...

Nece-Scope Int'l Co., Limited
Guangdong,China

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Dicing Silicon Wafer

Total 1238 products for dicing silicon wafer Manufacture & Suppliers

HPSI High Purity Semi-insulating SiC Wafers 2"3"4"6" 8" Prime/Dummy/Research Grade

Customized SiC Ceramic End Effector For Wafer Handling

Customized SiC Ceramic Boat Carrier For Wafer Handling

6inch SiC Epitaxial Wafer Diameter 150mm 4H-N Type 4H-P Type For 5G Communication

HPSI SiC Wafer 2-12 Inch Optical Grade for AI/AR Glasses

HPSI High Purity Semi-insulating SiC Wafers 2"3"4"6" 8" Prime/Dummy/Research Grade

8-12 Inch Glass Wafer Substrates for Semiconductor and Advanced Packaging Applications

4h-N 100um Silicon Carbide Abrasive Powder For SIC Crystal Growth

Silicon Carbide Mirror (SiC Mirror) – High-Precision Lightweight Optical Components

Φ100mm 0.5mm Single Crystal Quartz Wafer X-cut Y-cut for Pressure Sensor

Diamond Back Grinding Wheel For Silicon Sapphire Wafers Cut Glass Dremel Diamond Wheel

High End Wafer Dicing Saw Gallium Phosphide With Adjustable Blade Strength

Stable Operation Disco Diamond Blade , Electroplated Ceramic Wafer Saw Blade

Cutting Saw Hub Blade Customized Grit Size Ceramic Wafers Composite Plates

Tolerance +0.02~ 0 Dicing Saw Blade Durable For Cutting Brittle Quartz Glass

High End Wafer Dicing Saw Gallium Phosphide With Adjustable Blade Strength

Cutting Saw Hub Blade Customized Grit Size Ceramic Wafers Composite Plates

Stable Operation Disco Diamond Blade , Electroplated Ceramic Wafer Saw Blade

Tolerance +0.02~ 0 Dicing Saw Blade Durable For Cutting Brittle Quartz Glass

Trinocular Large Circuit Wafer Metallurgical Optical Microscope Extra Wide Field NCM-J1600