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The lollipop production line is mainly composed of batch roller, rope sizer, lollipop forming machine, cooling system and packing machine. It can mold different shapes of lollipops, insert the sticks automatica...
Wholesale Creative High Ending Promotional Metal Zinc Alloy Leather Souvenir Car Keychain With Accessories Brand Name AoWei Gift Item Name Wholesale Creative High Ending Promotional Metal Zinc Alloy Leather Sou...
Dust Collector Machine Plastic Components Custom Injection Mold 5 Reasons to use Custom Injection mold: Custom Injection mold is fast: Modern machine tools working with sophisticated computer programs can conve...
China ISO Foundry, Motor Aluminum Casting Customized, CNC part Product Introduction NOTICE:All the products on our website indicate the ranges we can manufacture and our production capability. We offer cast al...
Wholesale Creative High Ending Promotional Metal Zinc Alloy Leather Souvenir Car Keychain With Accessories Brand Name AoWei Gift Item Name Wholesale Creative High Ending Promotional Metal Zinc Alloy Leather Sou...
Dust Collector Machine Plastic Components Custom Injection Mold 5 Reasons to use Custom Injection mold: Custom Injection mold is fast: Modern machine tools working with sophisticated computer programs can conve...
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...Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other pr...
...Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, an...
...Die Bonder SDB200 Wafer Loading Introduction: It is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pre...
...Die Cutting Waterproof Acrylic Double Sided Tape 0.12mm Thickness Model: 3m55236 double-sided adhesive, Specification: 1200 mmx50m Thickness: 0.12 mm Color: white translucent Type: non-woven double sided adh...
...Flip-Chip Bonding processes in semiconductor manufacturing. Its core function is to stably adsorb and secure wafers or dies during bonding, ensuring micrometer or even sub-micrometer-level alignmen...
...Processing Ultra-Durable Tungsten Steel Deep Hole Nozzle Supporting the use of electronic eutectic machines, die bonding machines, and LED semiconductor packaging series equipment As a superhard metal tool m...
...Bonding Wire for Electronics and Communications Copper bonding wires are excellent for bonding in a ball / wedge process when using a reduced protective gas atmosphere. Cu wire bonding is also suitable for w...
...Solder Die Bonder Machine Original and Used ASM SD8312 Automatic Soft Solder Die Bonding System, Original and Used Die Bonding Machine Infinite Automation offers the best condition original and pre-owned ASM...
... 40-60 Cr high quality alloy steel,the material bureaucratizing,and the main drive gear and drive shaft adopt bond free connection mode to enlarge the virtual position,eliminate the...
... punching machine compared with the previous single-die process: 1. The single die process sequence is first cut, then the holes at both ends are punched out, and then the middle hole is punched out, and fin...
... for Semiconductor related equipment. Among our featured machines are original and used ASM AB589 Series Rotary Head Fine Aluminum Wire Bonding System. Infinite Automation has more than 200 hundred units of ...
...-off, poor collinearity Inspection method Image processing, machine learning Optical System Camera 65MP Lens High resolution bi-telecentric lens Resolution 4μm(2.4μm~10μm optional)RGB(......