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..." .004" .004" Max Board Thickness .200" .200" + .200" + Min Core Thickness .002" .002" .002" Min Dielectric .002" .001&...
Double Sided FR4 PCB Specification: Material FR4 Layers 2 L Size 18*16cm Color Green Board Thinckness 1.6mm Copper Thinckness 1 Oz Dielectric 4.2 Surface Finish Immersion Gold About FR4 Most printed circuit boa...
Double Sided FR4 PCB 94v0 blank hasl circuit board Specification: Material FR4 Layers 2 L Size 18*16cm Color Green Board Thinckness 1.6mm Copper Thinckness 1 Oz Dielectric 4.2 Surface Finish Immersion Gold Abou...
...: 36 floors Board thickness 6.0mm; Process structure: FR-4TG170, line width line spacing 12/12mil, dielectric constant 6.50, impedance ±5% + half hole + metal single side Surface treatment: electric gold 4U"...
.... Its high dielectric constant and low dielectric loss make it an ideal component for capacitors and other electronic components. Lanthanum oxide is also a key ingredient in the production of lanthanum-doped...
Wiring Density of Thick HDI Laminate Options Mid Tg FR4 HDI Dielectric / Prepreg High Tg FR4 PCB Technologies Printed circuit board (pcb) and PCBA products Communication terminal, communication station, electro...
...FR4 Rigid Multilayer PCB 0.4-3.5mm Thickness Features: 1. Fr4 pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products...
... results and offer high performance. The conductive link between the Heat Sink and the IC is basically the thermally conductive dielectric layer of the aluminum base. This concept is unlike FR4. The aluminum...
... of alumina-nitride-ceramic plate, AIN ceramic tube and other special parts. It has excellent flexural strength, hardness, maximum use temperature and dielectric constant, making it an ideal choice for a var...
... due to its high strength, high hardness, and low thermal expansion coefficient. Si3N4 ceramic ball is the most widely used form of this material. It has a dielectric constant of 9.2-9.6, a thermal expansion...
...e a low Poisson's Ratio of 0.27, high dielectric strength of 18-20 KV/mm, high density of 3.2 G/cm3, high dielectric constant of 9, and a high hardness of 13.9GPA. These advanced technical ceramics are ideal...
...Dielectric Polished Pink 96% Alumina Ceramic Substrate For Electronics The advantages of alumina ceramic substrate: 1. High thermal conductivity, up to 24 W/m.k at 25℃ 2. Good thermal shock resistance, great...
pcb board Multilayer PCB circuit board thick copper plate Processing Essential details Place of Origin: Guangdong, China Brand Name: pcb Base Material: Fiberglass Epoxy, Copper Copper Thickness: Hoz-10oz Board ...
...Dielectric Quick Detail : 1. Type : Pcb 2. Material : Rogers 3. Layer : Multilayer 4. Products Size :11*9cm 5. Permittivity : 2.5 6. Surface finish : Immersion Gold Features: RT/duroid® 5880 high frequency l...
... processes. They are based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower therma...
...YG6111 Semiconductor Thermal Joint Dielectric Compound Basic Properties Property Unit Value Appearance White Specific Gravity (25°C) 2.45 Penetration (JIS K 2220) 310 Thermal Conductivity W/m·K 0.84 Dielectr...
... ceramic plate, ensuring a high level of purity and consistency in its composition. One of the key attributes of the Aluminum Oxide Ceramic product is its impressive Dielectric Constant of 9.6. This...
...FR4 Machined Pin 1.27mm Pitch PGA Sockets Full Gold Plating Insulation FR4 Specifications Insulator Material FR-4 Fiberglass Epoxy Board Terminals Brass CuZn36Pb3 Contact Clip Beryllium copper Pitch 1.27mm, ...
... (Nom) ==================================================== 01 COPPER(1/2_OZ)OUTER 3.74 mil BSTAGE/DIELECTRIC 5.00 mil COPPER(1_OZ)INNER 1.08 mil FR4_017_CORE 17.00 mil COPPER(1_OZ)INNER 1.08 mil BSTAGE/DIEL...
... (Nom) ==================================================== 01 COPPER(1/2_OZ)OUTER 3.74 mil BSTAGE/DIELECTRIC 5.00 mil COPPER(1_OZ)INNER 1.08 mil FR4_017_CORE 17.00 mil COPPER(1_OZ)INNER 1.08 mil BSTAGE/DIEL...