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... printing ink 300±30 dPa﹒s VT-04F tamponade series Density after mixing (25℃) 1.30 ~1.50 g/ml Pot life after mixing 24 hour Store below 25℃ in...
... printing ink 300±30 dPa﹒s VT-04F tamponade series Density after mixing (25℃) 1.30 ~1.50 g/ml Pot life after mixing 24 hour Store below 25℃ in...
... printing ink 300±50 dPa﹒s VT-04F tamponade series Density after mixing (25℃) 1.30 ~1.50 g/ml Pot life after mixing 24 hour Store below 25℃...
...solder mask for led industry Items Features Notes Color Green Fineness ≤8µm 0 ~25µm Fineness gauge Mix ratio Base/Hardener=3:1 Weight ratio Solid content after mixing 75±3% Surface printing ink 82±3% tampona...
... printing ink 300±50 dPa﹒s VT-04F tamponade series Density after mixing (25℃) 1.30 ~1.50 g/ml Pot life after mixing 24 hour Store below 25℃ in...
...solder mask for printed circuit board,photoimageable curing Items Features Notes Color Shine black Fineness ≤8µm 0 ~25µm Fineness gauge Mix ratio Base/Hardener=3:1 Weight ratio Solid content after mixing 75±...
... printing ink 300±50 dPa﹒s VT-04F tamponade series Density after mixing (25℃) 1.30 ~1.50 g/ml Pot life after mixing 24 hour Store below 25℃ in...
... printing ink 300±50 dPa﹒s VT-04F tamponade series Density after mixing (25℃) 1.30 ~1.50 g/ml Pot life after mixing 24 hour Store below 25℃ in...
...solder mask for printed circuit board,photoimageable curing Items Features Notes Color Black Fineness ≤8µm 0 ~25µm Fineness gauge Mix ratio Base/Hardener=3:1 Weight ratio Solid content after mixing 75±3% Sur...
... printing ink 300±30 dPa﹒s VT-04F tamponade series Density after mixing (25℃) 1.30 ~1.50 g/ml Pot life after mixing 24 hour Store below 25℃...
...Solder Mask Blue Color For Screen Printing Circuit Board Items Technical features Notes Color Blue Fineness ≤8µm 0 ~25µm Fineness gauge Mixing ratio Base/Hardener=23/2 Weight ratio Viscosity after mixing (25...
...Soldering Machine for SMT Production Line Technical Specifications Specification Model 1 Model 2 Overall Dimensions 4050L × 1650W × 1850H (mm) 4050L × 1650W × 1850H (mm) PCB Size Min: 30(L) × 30(W); Max: 500...
SMD Reflow Oven R8,SMT Line Soldering Equipment SMD Adhesive SMT Reflow Oven for Potting Introduction: 1. Windows XP system with English and Chinese is easy to learn how to operate and can be change any time. 2...
... Terminal Finish Au 1u" Plating on Contact Area Matte Tin 80u" plating on solder tail Under Nickel Plating 50u" Min Over All Shield 50u" Min. Nickel underplated Overall Current Rating 0.5A Voltage ......
...Series Through hole DIP inductor,Leaded Power Inductor,Ferrite Core dip inductor with plastic case,unshielded choke Features: Plastic housing Water proof structure Ferrite Core Excellent Mechanical Strength ...
...Series Through hole DIP inductor,Leaded Power Inductor,Ferrite Core dip inductor with plastic case,unshielded choke Features: Plastic shell Waterproof structure ferrite core Excellent mechanical strength Exc...
... - Mating 100.0µin (2.54µm) Contact Material - Mating Phosphor Bronze Mounting Type Through Hole Features Open Frame Termination Solder Pitch - Post 0.100" (2.54mm)...
... - Mating 60.0µin (1.52µm) Contact Material - Mating Phosphor Bronze Mounting Type Through Hole Features Open Frame Termination Solder Pitch - Post 0.100" (2...
... - Mating 60.0µin (1.52µm) Contact Material - Mating Phosphor Bronze Mounting Type Through Hole Features Open Frame Termination Solder Pitch - Post 0.100" (2...
... - Mating 60.0µin (1.52µm) Contact Material - Mating Phosphor Bronze Mounting Type Through Hole Features Open Frame Termination Solder Pitch - Post 0.100" (2...