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... Laminating Substrate Item High-Yield 3000-4000m Coil-Format Dual-Metallized Laminating Substrate Length 200-3000m or customernized Thickness 21 mic Paper core 1 inch, 3 inch Material BOPP/ PET+ EVA Color Si...
...Substrate) Item 21μm High-Reflective Aurum-Plated Biaxially Oriented Polyester Film – 3000m Industrial Coil (Flexographic Printing Substrate) Width 310-1500mm or custom Length 200-3000m or custom Thickness 2...
... Substrate for High-Speed Hot-Stamp Packaging Thickness 21mic, 25mic Width 310mm or custom Length 200-3000m or custom Color Silver/gold Advantages Direct printing without additional coating , instant film re...
...PET Composite Film Thermofusion Bonded Mirror-Finish Substrate for Precision Graphic Transfer Length 200-3000m or customernized Thickness 21 mic Paper core 1 inch, 3 inch Material BOPP/ PET+ EVA Color Sil...
... Substrate for High-Speed Hot-Stamp Packaging Thickness 21mic, 25mic Width 310mm or custom Length 200-3000m or custom Color Silver/gold Advantages Direct printing without additional coating , instant film re...
...substrate Item Ultra-high reflectivity gold-plated, biaxially oriented polyester film flexographic printing substrate Width 310-1500mm or custom Length 200-3000m or custom Thickness 21 mic Paper core 1 inch,...
Copper Magnetron Sputtering Deposition System , Direct Plating Cooper On LED Ceramic Substrates Performance 1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr. 2. Operating Vacuum Pressure: 1.0×10-4 Torr. 3...
... is Ceramic Radiating Substrate. Silver / Copper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, has above all one big advantage compared to traditio...
...substrate splitting machine 220v 45kg YSVC-3S Specification: Model: YSVC-3 The Longest Minimize: unlimited Size: 780x500x620mm Minimize thickness: 0.3-3.5mm Machine Weight: 185Kg Cutting speed:300-500mm/s Fe...
130 KG Roll To Roll A1 UV DTF Printer i3200 Direct Substrate/Film Printing Made Easy #detail_decorate_root .magic-0{vertical-align:top}#detail_decorate_root .magic-1{padding:0;margin:0;color:#333;font-size:......
... that deposits thin films onto various substrates. The process begins by placing the substrate inside a vacuum chamber. The chamber is then evacuated to remove contaminants and create a controlled environmen...
Dia 50mm Piezoelectric Effect LGS Single Material Custom Angle Direction Lanthanum gallium silicate ( La2Ga5SiO14 ) is a phenomenal invention. Though langasite was initially developed as a laser crystal, it rev...
... process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate. Cooper conductive film depo...
...Separator machine has greatly improve the quality of splitting the PCB Boards. ● It can realize the V-groove X and Y direction two-ways auotmatic slitting, it can cutting the aluminum substrate (300-1500mm),...
AlN on Diamond template wafers AlN epitaxial films on Diamond substrate AlN on Sapphire /AlN-on-SiC/ AlN-ON Silicon Welcome to Know AlN Template on Diamond~~ Advantages of AlN • Direct band gap, band gap width ...
2inch GaAs substrates, GaAs wafer for led,Gallium Arsenide crystal Wafers,Si/Zn Dopant GaAs wafer(A compound of the elements gallium and arsenic. It is a III-V direct bandgap semiconductor with a zinc blende cr...
...substrates -------------------------------------------------------------------------------------------------------------- GaAs) Gallium Arsenide Wafers Gallium arsenide (GaAs) is a compound of the elements g...
...Substrates 350um 650um Description of InP wafer: InP (Indium phosphide) chips are a commonly used semiconductor material for the manufacture of high-performance optoelectronic devices such as photodiodes, la...
...Packaging Detail description: Suitable application: suitable for PVDC coating for food packaging. Characteristics 1. Direct transfer coating, different substrates laminating 2. Anilox coating, adhesive trans...