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Clear Epoxy Resin Jewelry,Craft Casting Resin Ratio 1 To 1 Description of MC-ER1185A/B Crystal Clear Epoxy Resin MC-ER1185A/B is two-component transparent epoxy resin compound that cures at room temperature and...
... Modified epoxy resin Company Name: HUBEI JIANGTE INSULATION COMPOSITE CO., LTD. Add: Room219 Zhanghua Road(N), EDA Qianjiang City, Hubei Province, ......
Description: MC-ER1185A/B Crystal Clear Epoxy Resin is two-component transparent epoxy resin compound that cures at room temperature and high temperature. Epoxy Resin features with low mixing viscosity, good de...
1:1 Quick Cure Epoxy Resin For Jewelry Crafts Product Description of 1:1 Quick Cure Epoxy Resin For Jewelry Crafts MC-ER1180A/ER1182B is a two-component transparent epoxy resin compound that cures at room tempe...
... epoxy resin compound that cures at room temperature and high temperature. It features with low mixing viscosity, good de-aeration; long working time at room ......
... epoxy encapsulant compound. lt is design for potting of capacitors and electricaldevices. TIE280-12AB-Series-Datasheet (2).pdf Feature > Good thermal conductive: 1.2W/......
Clear Liquid Epoxy Resin And Hardner Potting Compound Casting For Insulation Transfomer CT PT VT MV Proportion: JT 8980A Epoxy Resin 100 pbw JT 8980B Epoxy Hardener 100 pbw Flexibilizer D40 0-20 pbw Accelerator...
...Epoxy Usage Vacuum casting Process and electrical insulation Other Names epoxy resin potting compound MF C21H24O4 EINECS No. 216-823-5 Classification Double Components Adhesives Brand Name JT-RESIN Model Num...
...epoxy resin has an impressive gelation time of 80°C/4 Hrs+100°C/2hrs+120°C/2hrs, ensuring that it sets quickly and efficiently, saving you time and resources. This dielectric epoxy glue boasts a dielectric s...
Epoxy Resin AB Glue Epoxy Potting Compound For Electronic Components Encapsulation Quick Detail: Name Epoxy Resin 1311 Usage Epoxy floor coatings Mixing Ratio A: B =2:1 (By weight) Applications Epoxy floor coat...
Epoxy Resin AB Glue Epoxy Potting Compound For Electronic Components Encapsulation Quick Detail: Name Epoxy Resin 1311 Usage Epoxy floor coatings Mixing Ratio A: B =2:1 (By weight) Applications Epoxy floor coat...
6321C is a two component EPOXY adhesive product, specially developed for Hollow fiber membrane modules. 6321C is a two component EPOXY adhesive product, specially developed for Hollow fiber membrane modules. It...
Product Description 3:1 Clear Epoxy Resin for making counter top/ river table top coating Product Description: MC-ER3185A/B is a two-component transparent epoxy resin compound that cures at room temperature and...
Deep Pour Epoxy Resin for Tabletop Product Description: MC-ER2185A/ MC-ER2186B is a two-component transparent epoxy resin compound that cures at room temperature. It has the following characteristics: high temp...
Clear Epoxy Resin for Floor Coating Product Description: MC-ER2180A/ER2182B is a two-component transparent epoxy resin compound that cures at room temperature. It has the following characteristics: high tempera...
High-Hardness Transparent Craftwork Epoxy Resin Product Overview BZ-710-T is a two-component high-hardness transparent epoxy resin designed for creating crystal-clear craftworks and protective coatings. Its exc...
TIE380-25 One Part Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound Thermal Conductive Epoxy Glue Product Summary: TIE™380-25 is a one component, heat cured epoxy adhesive. It has excellent thermal condu...
...life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices. TIE280-12AB-Series-Datasheet (1).pdf Features > Good thermal conductive: 1.2W/......
4.5W/MK Thermal Conductive glue Material Conductive Epoxy Resin Potting Compound adhesive Gel Low Thermal Resistance TIE380-45 is a single-component heat-curable modified epoxy resin adhesive containing high-p...
High Performance One Component Thermal Conductivity Epoxy Glue for electronic potting compound Product Summary: TIETM380-25 is a one component, heat cured epoxy adhesive. lt has excellent thermal conductivity a...