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High TG FR4 10layer HDI printed circuit boards manufacturer Material Copper Base material: FR4 Layer: 8layers with impedance control & BGA Board thickness: 1.6 mm Copper thickness: 1 oz Surface finish: ENIG Sol...
... Minimum Via 0.1mm Surface treatment ENIG,OSP Board thickness 0.15-4.5mm Solder mask color Gree,Blue,Black,Red,White Tolerance of board thickness T>=1.0mm, Tol: +/-10% T<1.0mm, Tol:+/-0.1mm 2.HDI capablity and example 1) X+X process ( Layer Drawing)...
...FR4 Multilayer HDI PCB with Buried and Blind Via Holes 1. Product Descprition Item Specification Material High TG FR4 Layers 4-20 layers HDI HDI plus 1 or 2 Copper thickness 1/3-12OZ Minimum Via 0.1mm Surfac...
...Fr4 HDI PCB Manufacturing 1. Product Descprition Item Specification Material High TG FR4 Layers 4-20 layers HDI HDI plus 1 or 2 Copper thickness 1/3-12OZ Minimum Via 0.1mm Surface treatment ENIG,OSP Board th...
... Minimum Via 0.1mm Surface treatment ENIG,OSP Board thickness 0.15-4.5mm Solder mask color Gree,Blue,Black,Red,White Tolerance of board thickness T>=1.0mm, Tol: +/-10% T<1.0mm, Tol:+/-0.1mm 2.HDI capablity and example 1) X+X process ( Layer Drawing)...
...FR4 Flex Gold Printing Circuit Board HDI PCB 1. Product Descprition Item Specification Material High TG FR4 Layers 4-20 layers HDI HDI plus 1 or 2 Copper thickness 1/3-12OZ Minimum Via 0.1mm Surface treatmen...
10 Layer Rigid-Flex Printed Circuit Board , PI+FR4 Material , 1.6MM Thickness PCB Specifications: Layer Count: 10Layer Rigid-Flex PCB Board Thickness: 1.6MM Material: FR4 High TG+PI Structure: L1-L2 Rigid Layer...
...FR4 Material , S1000-2 8 Layer Hard Gold PCB PCB Specifications: Layer Count: 8 Layer Hard Gold PCB Board Thickness: 1.6MM Material: FR4 S1000 Copper Thickness: 1/1/1/1/1/1/1OZ Min Hole: 0.25MM Min Line: 4/4...
... Vin In Pad, Resin Plugged in Holes Solder Mask: Black Surface Treatment: Hard Gold Plating+ENIG Gold Thickness: 120U'+2U' Application: Air Plane Our Products&Services: FAQ: Question: Why...
... Treatment: ENIG Application: 5G Blue-tooth module Capabilities: Item Capability Layer Count 1-24 Layers Board Thickness 0.1mm-6.0mm Finished Board Max Size 700mm*...
... Cutting Number of layers 1-48 Min.thickness for inner layers (Cu thickness are excluded) 0.003”(0.07mm) Board Thickness Standard (0.1-4mm±10%) Min. Single/Double:0.008±0.004” 4layer:0.01±0.008” 8layer:0.01±...
...Capability Material Laminate materials FR4, High TG FR4, High Frequency, Alum, FPC... Board Cutting Number of layers 1-48 Min.thickness for inner layers (Cu thickness are excluded) 0.003”(0.07mm) Board Thick...
...Capability Material Laminate materials FR4, High TG FR4, High Frequency, Alum, FPC... Board Cutting Number of layers 1-48 Min.thickness for inner layers (Cu thickness are excluded) 0.003”(0.07mm) Board Thick...
...Capability Material Laminate materials FR4, High TG FR4, High Frequency, Alum, FPC... Board Cutting Number of layers 1-48 Min.thickness for inner layers (Cu thickness are excluded) 0.003”(0.07mm) Board Thick...
...Description Capability Material Laminate materials FR4, High TG FR4, High Frequency, Alum, FPC... Board Cutting Number of layers 1-48 Min.thickness for inner layers (Cu thickness are excluded) 0.003”(0.07mm)...
...... Board Cutting Number of layers 1-48 Min.thickness for inner layers (Cu thickness are excluded) 0.003”(0.07mm) Board Thickness Standard (0.1-4mm±10%) Min. Single/Double:0.008±0.004” 4layer:0.01±0.008” 8la...
... Cutting Number of layers 1-48 Min.thickness for inner layers (Cu thickness are excluded) 0.003”(0.07mm) Board Thickness Standard (0.1-4mm±10%) Min. Single/Double:0.008±0.004” 4layer:0.01±0.008” 8layer:0.01±...
... Capability Laminate materials FR4, High TG FR4, High Frequency, Alum, FPC... Number of layers 1-48 Min.thickness for inner layers (Cu thickness are excluded) 0.003”(0.07mm) Standard (0.1-4mm±10%) Board Thic...