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Silicone Thermal Conductive Gap Filler With Room Temperature Curing For LED Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/s) ...
Silicone Thermal Conductive Gap Filler With High Thermal Conductive Up To 3W/m.K Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(...
Single Part Silicone Thermal Conductive Gap Filler With Room Temperature Curing Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g...
Single Part Thermal Conductivity Gap Filler With Silicone UL94V-0 Flammability Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/...
3.0W/m.K Thermal Conductivity Silicone Gap Filler For UAV With 2.9g/Cc Density Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/...
3W/m.K Thermal Conductivity Silicone Gap Filler Usage Temperature -40~150 Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/s) 5...
3.0 W/m.K Low Volume Resistivity Thermal Conductive Silicone Gap Filler For EPS Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g...
TF300 Series Light Blue Two Parts Factory Direct Supply Silicon Gel Liquid Gap Filler Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Light B...
Light Blue Thermal Conductive Liquid Gap Filler Silicon Pad Gel For Cooling LEDs Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Light Bule V...
3W/m.K Thermal Conductivity Silicone Liquid Gap Filler Usage Temperature -40 ℃ ~ 150 ℃ Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Light ...
Black Thermal Conductivity Silicone Liquid Gap Filler With High Breakdown Voltage Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Light Bule ...
3W/m.K Thermal Conductivity Silicone Liquid Gap Filler With UL94V0 Flammability Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Light Bule Vi...
... of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal r...
...Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstandi...
6.5W/MK Silicone-Based Thermal Gap Pad Thermal Management Thermal GAP PAD Materials For Network Communication Products The TIF500-65-11ES Series is a thermal pad specifically designed to tackle the high level ...
Gray Thermal Conductive Material Thermal Gap Filler 45 Shore 00 TIF830HP 12.0 W/M-K The TIF830HP Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and...
... blue thermal silicone gap filler Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductiv...
...fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling TIF540-30-11US maintains a conformable, yet elastic nature that provides excellent ......
... Gap Filler Tputty 508 Laird Single Tube 3.7W MK Product Description Laird Tputty 508 is a single part dispensable material designed with automation and vertical stability in mind. Laird has leveraged its kn...
Good Insulation Performance 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling The TIF®500-65-11U Series is an ultra-soft thermal interface material designed specifically to protect precision compon...