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... High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery TS-TIF®100C 6050-11 series is a silicone-based thermal material designed to fill the gaps bet...
Custom High Performance Cpu Silicone High Thermal Conductivity Pad thermal gap filler Factory TS-TIF100C 3030-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating co...
...Stability RoHS Compliant Thermal Pad Thermal sheet thermal gap filler For EV Batteries Protection TIF®100C 10075-11 series is a silicone-based thermal material designed to fill the gaps between heat-generati...
...Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components TIF®700NUS series of thermal interface materials is specficlly designed to fill air gaps between heat-generating c...
Naturally Tacky 6.5W Ultra Soft Thermal Conductive Gap Filler Pad For LED CPU GPU EV Battery TIF®100 6520-11 series of thermal interface materials is specifically designed to fill air gaps between heat-generati...
Customized Self Adhesive Thermal Gap Filler Pad Silicone Thermal Pad TIF®100 10055-62 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat ...
Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules TIF®100C 10075-11 series is a silicone-based thermal material designed to fill the gaps between he...
Premium Soft 2.5W Silicone Thermal Pad Thermal Conductive Gap Filler Pad For Electronic Equipment TIF100N-25-16S series is a silicone-based thermal material designed to fill the gaps between heat-generating co...
High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element TIF100-35-11UF thermally conductive interface materials are applied to fill the air gaps between the heating eleme...
Cooling Gap Filler 2.0W Thermally Conductive Silicone Thermal Pad High Temperature Application TIF540-20-11U series thermally conductive interface materials are applied to fill the air gaps between the heating ...
...applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can ......
Thermal Conductive Silica Sheet 6.5W Thermal Gap Filler Pad For Telecommunication Equipment TIF700NES Series thermally conductive interface materials are applied to fill the air gaps between the heating elemen...
... Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Laptop Desktop GPU Computer Product description TIF100-10-02F Series thermally conductive interface materials are applied to fill the a...
... gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can ......
Optical Module 1.5W/MK Thermally Conductive Gap Filler Pads With Good Insulation Performance The TIF100-15-50S thermally conductive interface materials are applied to fill the air gaps between the heating elem...
..., designed specifically for optical and high-precision applications. Its soft and elastic material can fill the uneven gaps between heating elements and heat sinks or metal bases, limprove thermal conductivi...
...Gap Filler for Cooling Components / LED TV The TIF™400 Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excel...
... 2.0 W/mK Thermal Gap Filler TIF180-20-07E 2.032 mm Silicone rubber sheet in 35shore00 hardness The TIF180-20-07E is a high performance and compatible non-silicone material of the thermal conductive interfac...
...flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Their flexibility and elasticit...
...gap filling material rated at a thermal conductivity of 2.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performan...