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... of 2000 hours. -6. More lower price than ESL and LED. -7. UV filter; -8. Applications: can be used in shop, hotel, indoor decorative and floor lighting. Home design lighting,...
...Light Bulb Video Spotlight Bulb Photographic Halogen Lamps Specification Of Quartz Halogen Bulb Name 230v 115V 575W Quartz Halogen Bulb Voltage 115V 230v Power 575W Overall Length 98mm Width 17mm Light Cente...
...Halogen Lamp Cup Lamp Beads Crystal Lamp Pin Bulb Quick Details current (A): 6.6A Warranty(Year): 1-Year Support Dimmer: Yes Lighting solutions service: Lighting and circuitry design Color: White Material: G...
... decline. 2 Directly with 240v/100v AC power connection. 3 Is the 50w traditional halogen light sources or 70w halogen light source the best alternative to strangers, 4 Excellent heat dissipation, beautiful,...
... decline. 2 Directly with 240v/100v AC power connection. 3 Is the 50w traditional halogen light sources or 70w halogen light source the best alternative to strangers, 4 Excellent heat dissipation, beautiful,...
...Light IP63 Waterproof 2700K - 7000K Products advantages 1 High brightness, high color rendering, color temperature selection range is wide and light a small decline. 2 Directly with 240v/100v AC power connec...
...Light / T8 LED Tubes Energy-saving and Eco Friendly Products advantages 1 High brightness, high color rendering, color temperature selection range is wide and light a small decline. 2 Directly with 240v/100v...
Photography lights CHIPS 180W 620nm/460nm/520nm/2700K/6500K 140LM/W 14-20A 35-40V With Outdoor Lighting LED CHIP Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitr...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...