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Product Paramenters Roller speed Om pressed air Roller width Cutter speed Net weight Dimension(cm) 0-7cm/S 0.5Mp 6/8/10/15 and custom made 0-30000 rpm 77KG 121x56x118 Nozzle temp Power supply Power Heating tank...
Product Paramenters Roller speed Om pressed air Roller width Cutter speed Net weight Dimension(cm) 0-7cm/S 0.5Mp 6/8/10/15 and custom made 0-30000 rpm 77KG 121x56x118 Nozzle temp Power supply Power Heating tank...
Product Paramenters Belt speed Ompressed air Belt Nozzle temp Power supply Roller width 0.7cm/S 0.6Mp 791X30mm 1320X30cm 0-300 220V-240VAC/110VAC 50HZ/60HZ Standard 3.0 other specifications can be arbitrary op...
Product Paramenters Roller speed Om pressed air Roller width Cutter speed Net weight Dimension(cm) 0-7cm/S 0.5Mp 6/8/10/15 and custom made 0-30000 rpm 77KG 121x56x118 Nozzle temp Power supply Power Heating tank...
Product Paramenters Roller speed Om pressed air Roller width Cutter speed Net weight Dimension(cm) 0-7cm/S 0.5Mp 6/8/10/15 and custom made 0-30000 rpm 77KG 121x56x118 Nozzle temp Power supply Power Heating tank...
...heat exchanger components widely used to enhance heat transfer efficiency. Unlike other types of fins, the fins of Longitudinal finned tubes are in "U" channel shape. The fins are adhered or welded to the tu...
... tape with high initial adhesion, heat resistance, strong bonding and peeling force, and good residue-free performance, ideal for electronic component bonding and wrapping. Applications Electronic component ...
...fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the me...
...LED Aluminum Plate Heat Dissipation The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape pos...
...Processing For LED Mount Heat Sink The TIA™808FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape poss...
... power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and ...
Heat Sink Acrylic Based Gluehighly Double Side Thermal Conductive Acrylic Tape for LED strip The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power cons...
...LED Mount Heat Sink Conductive tape 0.9 W/MK The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive...
... Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesi...
... semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing....
... Double Sided Heat Conductive Tape For PC The TIA™800 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape...
... consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechan...
Wholesale High Heat Resistance Honeycomb Board Bonding Glue Pur Hot Melt AdhesiveSpecification Product Name PUR Hot Melt Adhesive Material Solid Colour White Size 20kg Characteristic Very high heat resistance. ...
...Adhesive Heat-Conducting Double-Sided Adhesive The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesi...
...Adhesive Tape for LED and heat sink The TIA™600 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape posse...