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...Thermally Conductive Potting Compound: HN-8820 RTV potting gel offers V-0 flame retardancy and reliable performance from -40°C to 150°C. It ensures long-term durability for demanding applications. Performanc...
...Thermal Conductive Gel Thermally Conductive Gel With Ultra-High Thermal Conductivity 1.5W Thermal Gel TIFTM015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer sup...
...High Temperature Resistance Silicone Heating Thermal Conductive Insulation For Gpu Cpu Heatsink The TIS®805-16-03 Series of products are highly efficient insulating products and they also have thermal conduc...
...High Temperature Furnace Molybdenum Parts Rack Quick Details Material: 99.95% Pure Molybdenum Purity: 99.95% Density: 10.2g/m³ Size: customized Standard: ASTM B387 Surface: Grey/ polishing Melting Point: 261...
...Temperature Cured Thermally Conductive silicone Adhesive TIS™580-20 Series is dealcoholized, one component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and...
...Temperature Cured Thermally Conductive Silicone Adhesive TIS™580-10 Series is dealcoholized, one component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and...
...Temperature Cured Thermally Conductive Silicone Glue TIS™580-13 Series is dealcoholized, one component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adh...
...Thermal Conductive Gel Thermally Conductive Gel With Ultra-High Thermal Conductivity 1.5W Thermal Gel TIFTM015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer sup...
... curing properties. It can complete the curing process at room temperature and is convenient for on-site operation and construction. And this material has excellent fire and flame retardant properties, which...
...Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound For Circuit Board Product Summary: TIE®280-15AB is a two-component epoxy resin sealantwithgood thermal conductivity and room temperature curing propert...
...(g/s) 5.0 ISO9048 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL9...
...(g/s) 5.0 ISO9048 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL9...
... temperature curing, long working time, and flame retardant properties. This product is particularly suitable for sealing capacitors and small electronic devices. Its ......
... issue. TIG™780-30 is presenting thermal paste products. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dissipatio...
...the advantages of high temperature resistance, good thermal stability, low thermal conductivity, small heat capacity, good thermal insulation performance, good high temperature thermal insulation performance...
High Thermal Conductive Pad For Automotive Silicon Thermal Pad Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conducti...
...Thermal Conductive Gap Filler thermal pads For High Speed Mass Storage Drivers Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, the...