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...Bga Chip Rework Machinery Motherboard Repairing Equipment WDS-1250 Product Description Application 1.All mobile phone ic chip repair such as iPhone serious, Samsung, Huawei, etc; 2.PC, tablet, notebook, desk...
WDS-620 Optical Alignment BGA Rework Station heating picking up bonding the chip Higher automatic function Newest WDS-620 is the updated system with 5 modes.Its Remove,Mount,Weld,Manual and Semi-auto.The mode ...
***Wisdomshow in line with reasonable prices,excellent quality and sincere service to you*** How to contact us Our Aim: Quality, Service, Guarantee! Welcome to visite our company ! .......
... tin,OSP… Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days servic...
... tin,OSP… Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days servic...
... and Thru-hole 2 Solder Type Water Soluble Solder Paste,Leaded and Lead-Free 3 Components Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carries/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mils BG...