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...Thermally Conductive Silicone Encapsulant Usage Temperature -40℃ ~ 150 ℃ Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sliver Grey Visua...
...Thermal Conductivity Silicone Encapsulating For Sensor Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sliver Grey Visual Density(g/cc) 1....
...Thermal Conductivity Silicone Encapsulating For Power Battery Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sliver Grey Visual Density(g...
Thermally Conductive Encapsulant Gray Elastomer With Moderate Thermal Conductivity Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sliver Gre...
Ultra Soft Thermal Pad Ultra soft and highly compliant with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced Fiberglass - Color White and Brick Red ...
Ultra Soft Low Resistance 1.0W/m.K Thermal Conductivity Silicon Thermal Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced Fiberglass - Color White and Brick Red Visual Thickne...
0.5mm Thickness Ultra Soft 1.0W/m.K Thermal conductivity Silicon Thermal Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced Fiberglass - Color White and Brick Red Visual Thickn...
...Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Bre...
Low Thermal Resistance 8 W/m.K Pink Silicone Thermal Pad Material For Networking Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc...
...Thermal Pad Material For Power Modules Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±...
...Thermal Conductivity Thermal Pad Silicone Material For Robots Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792...
...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D7...
...Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Bre...
...Thermal Insulation Pad For LED Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual Thickness(mm) 0.25 astm d374 Usage Temperature(℃) -40~200 -- Shear...
...Thermal Conductivity Thermal Insulation Silicone Pad For Power Adapter Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual Thickness(mm) 0.25 astm d3...
...Thermal Conductivity Thermal Insulation Silicone Pad For Projector Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual Thickness(mm) 0.25 astm d374 U...
...Thermal Conductivity Thermal Insulation Silicone Pad For PV Inverter Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual Thickness(mm) 0.25 astm d374...
...Thermal Resistance 1.4W/m.K Thermal Insulation Silicone Pad For IGBT Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual Thickness(mm) 0.25 astm d374...
...Thermally Conductive double side Pressure Sensitive Adhesive Tapes The TIA™600 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. T...
SD customzied size MPCVD method GaN&Diamond Heat Sink wafers for Thermal management area Diamond has wide band gap, high thermal conductivity, high breakdown field strength, high carrier mobility, high temperat...