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Sensor IC OX01F10-B58Y-LC 1.3MP Color CMOS HDR Image Sensor BGA Package Product Description Of OX01F10-B58Y-LC OX01F10-B58Y-LC is a 1.3MP SoC, providing automotive designers with the industry’s best imaging per...
...) is a high-speed CMOS dynamic random access storage device. The memory device uses multi-chip package (MCP) and package stack (PoP) design to save PCB space. Typical applications include automotive, industr...
BES3001-SP BT IC Ultra-Low Power Single Chip Audio Codec BGA-48 Package Product Description Of BES3001-SP BES3001-SP is a single-chip audio codec designed for USB Type-C headphones / headsets. The platform inte...
BES3002-SP BT IC High Performance Single Chip Audio Codec QFN-50 Package Product Description Of BES3002-SP BES3002-SP is a single-chip audio codec designed for USB Type-C headphones / headsets. The platform inc...
...IC Chip 8-Port 12Gbps Smart I/O Controller For Storage BGA Package Product Description Of PM8225B SmartIOC SAS I/O Controller products provide reliable ultrahigh performance HBA functionality with industry-l...
...-RDC Memory IC Chip 4Gbit DDR3 SDRAM Memory Chip FBGA96 Product Description Of H5TQ4G63EFR-RDC H5TQ4G63EFR-RDC is a 4Gbit DDR3 synchronous dynamic random-access memory (SDRAM) chip in an FBGA-96 package, pr...
..., and a variety of package options such as QFP and BGA. With a programming voltage range of 2.7V to 5.5V, and an ESD protection level of 2KV HBM, this Programmable IC Chip is an ideal choice for digital to a...
... Design, Consumer Industrial Design. -This detergent packaging pouch glossy finish, which can help you to show your brand more effeciently. -You can also leave a message to us about what you need exactly. We...
...Packaging Machine Frozen French Fries Weighing Packing Machine Product Description: The Automated Packaging System is an advanced automated packaging system designed to offer large packaging capacity and low...
NV6135C GaN IC GaNFast™ Power IC High Performance eMode GaN FET IC Product Overview The NV6135C GaN IC is a high-performance eMode GaN FET IC featuring GaNFast™ Power IC technology, designed for efficient power...
IC Integrated Circuits ADP1034ACPZ-1-R7 LFCSP-41 PMIC - Power Management ICs Specifications Product Attribute Attribute Value Manufacturer: Analog Devices Inc. Product Category: Power Management Specialized - P...
... Product: Isolated Gate Drivers Type: High-Side, Low-Side Mounting Style: SMD/SMT Package / Case: SOIC-14N Number of Drivers: 2 Driver Number of Outputs: 2 Output Output Current: 5 A, 9 A Series: 2EDR9259 Pa...
...IC 2SC1321 Ic Chips Electronic Components Surface Mount TO-236 2SC1321 Product Paramenters Type Designator: 2SC1321 Material of Transistor: Si Polarity: NPN Maximum Collector Power Dissipation (Pc): 0.1 W Ma...
...Packaging Trays Environmental Friendly ● Specializing in precision design of packaging ● Design focus on the balance of quality and cost, comformity of tooling and mass production. ● Interanl design process ...
... Detergent Packaging Liquid Laundry -Sealed Detergent Packing Bag -Consumer Brand Identity, Consumer Rebranding, Consumer Graphic Packaging Design, Consumer Structural Packaging Design, Consumer Industrial D...
...IC Chip BGA Package Apple IMac IC Chip Product Description Of CS42L83A-CWZR CS42L83A-CWZR is Apple IMac/Audio Chip - Iphone IC Chip, package is BGA. Specification Of CS42L83A-CWZR Part Number: CS42L83A-CWZR...
...IC Chip BCM47764KUBG GNSS Receiver BGA Package Apple Watch 7 IC Chip Product Description Of BCM47764KUBG BCM47764KUBG is Apple Watch 7 - GNSS Receiver, package is BGA. Specification Of BCM47764KUBG Part Num...
...IC Chip 4 GB eMMC Memory IC FBGA-153 Package Product Description Of THGBMNG5D1LBAIL THGBMNG5D1LBAIL is 4 GB eMMC Memory IC,the package is FBGA-153. Specifications Of THGBMNG5D1LBAIL Package/Case: FBGA-153 Me...
...Using transparent material, consumers can clearly see the heater product inside the packaging. The packaging features a buckle design that securely seals and protects the product from damage. The three fold ...
...IC Packing Tube / Profile Extrusion Machine , IC Tubing Extrusion Line IC packaging tube/profile purposes: Integrated circuit resistor and capacitor and components are easy damaged in the transport process, ...