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...IC Chip 4GB 2400Mbps DDR4 Memory Chip BGA-78 Package Product Overview Of CXDQ2BFAM-CE-B The CXDQ2BFAM-CE-B is a DDR4 memory chip manufactured using advanced semiconductor processes. This product features a c...
XCF04SVOG20C Programmable IC Chip - Ideal for Advanced Data Processing XCF04SVOG20C Programmable IC Chip Parameters: Voltage Range: 1.2V to 3.6V Operating Temperature: 0°C to 70°C Package Type: QFN Number of I/...
XC3S50A-4VQG100C Programmable IC Chip High Performance and Reliable Processing Xilinx XC3S50A-4VQG100C Programmable IC Chip Features: • 4VQG100C package • Includes 50,000 gates of logic • Up to 200MHz of perfor...
...IC Chip Gate Array (FPGA) IC Package 144-LQFP Number of LABs/CLBs 288 Number of Logic Elements/Cells 4608 Total RAM Bits 119808 Number of I/O 89 Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount Ope...
...FETs) are produced using Fairchild's patented high cell density DMOS technology. This high-density process is designed to minimize on-state resistance, providing robust and reliable performance and fast ...
... Operating Frequency: 30MHz • Input Capacitance: 5pF • Output Capacitance: 8pF • Pin Count: 8 • Mounting Type: Surface Mount • Package / Case: SOIC-8 • Brand: Analog Devices • Max Processing Temp:...
...) package, and is suitable for applications such as telecommunication, storage, and data processing. Features: • 324-pin BGA package • 28K logic elements • Up to 18,432 Kbits of embedded memory • Up to 576Kb...
...IC is a modern state-of-the-art integrated circuitry design that can be used in a wide variety of applications. It is designed to operate within a voltage supply range of 4.75V to 9.5V, and is packaged in a ...
...IC High Frequency GaNSense™ HFQR Flyback Controller QFN-23 Package GaN IC featuring High Frequency GaNSense™ HFQR Flyback Controller technology for advanced power management applications. MJD Advantage 15+ y...
...IC Ultra-Low Power 20mW GaNSense™ HFQR Controller High-performance GaN IC featuring ultra-low power consumption of 20mW with GaNSense™ HFQR controller technology in compact QFN-23 package. MJD Advantage 15+ ...
...IC 700V 260mΩ GaNSense™ HFQR Flyback Controller High-performance GaN IC featuring 700V rating and 260mΩ resistance in compact QFN-23 package. The GaNSense™ HFQR Flyback Controller delivers superior power eff...
...Processing Equipment stainless steel Description of Filling Packing Equipment Dairy Processing Equipment Packaging equipment refers to the equipment that can complete the whole or part of the product and com...
...IC Chip Tray For IC Devices ESD Black Plastic Storage Chip Tray For For Carrying IC With Different Size Chip tray is a carrier for bare dies used for the transportation and handling of a small batch of dies....
...IC Chip APL109C/343S00554 Iphone Macbook AIR/Performance Manager IC Product Description Of APL109C/343S00554 APL109C/343S00554 is Iphone ic chip,Iphone Macbook AIR/performance manager IC.Package is BGA. Spec...
Product Description can only control starch packaging equipment grain starch packaging processing line The parts contact with materials are made of stainless steel.Automatic starch package machine packing range...
Product Description Automatic Electric Cassava Flour Packaging Machinery Cassava Flour Package Processing Line Application of automatic packaging machine The main quantitative packing in the powdery material co...
...Processing FPGA WLCSP-84 Manufacturer: Lattice Product Category: FPGA - Field Programmable Gate Array Number of logic elements: 33000 LE Supply voltage - minimum: 950 mV Supply voltage - Max: 1.05 V Minimum ...
...IC Chip Tray 2 Inch ESD Anti Static Completely In Line With The Environmental Protection Of The Anti-Static Chip Tray IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD...
...: 3.6 V Supply Voltage - Min: 3 V Minimum Operating Temperature: - 40 C Maximum Operating Temperature: + 85 C Mounting Style: SMD/SMT Package / Case: SOIC-8 Packaging:...
...Supply 0.95V ~ 1.05V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Package / Case 484-BBGA Supplier Device Package 484-FBGA (23x23) Product: XC7A50T-L2FGG484E Programmable IC Chip Specif...