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Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; ......
...Package Cutting Knives Machining Different Dimension Name Steel Precision Food Package Cutting Knives Machining Different Dimension Material Tool Steel Size 15*10*20mm 25*15*10mm etc. MOQ 500 piece Packagin...
...Package Cutting Knives Machining Different Dimension Name Steel Precision Food Package Cutting Knives Machining Different Dimension Material Tool Steel Size 15*10*20mm 25*15*10mm etc. MOQ 500 piece Packagin...
LM3567A1YCGR Iphone IC Chip LM3567 DSBGA25 LED Flash Driver IC Product Description Of LM3567A1YCGR LM3567A1YCGR is LED Flash Driver IC, package is DSBGA25. Applications Of LM3567A1YCGR Iphone 14pro max Product ...
SN74AUP1G08DCKR Integrated Circuit IC Chip Single 0.8V To 3.6V Low Power AND Gate Logic ICs Package SC-70-5 SN74AUP1G08DCKR Category Logic ICs/Gates Low Level Range (VIL) 0.7V~0.9V High Level Range (VIH) 1.6V~2...
128Mbit Memory IC Chip S25FL128SAGMFI000 133MHz NOR Flash Memory IC 16-SOIC Product Description Of S25FL128SAGMFI000 S25FL128SAGMFI000 is 128Mbit Quad SPI FLASH - NOR Memory IC, package is 16-SOIC. Specificati...
THGAMRG8T13BAIL Memory IC Chip 256Gbit NAND Memory IC FBGA-153 eMMC Flash Drives Product Description Of THGAMRG8T13BAIL THGAMRG8T13BAIL is eMMC Flash Drives - 256Gbit NAND Memory IC, package is FBGA-153. Speci...
MT53E2G32D4DE-046 WT:C Memory IC Chip 64Gbit Parallel DRAM LPDDR4X Memory IC TFBGA200 Product Description Of MT53E2G32D4DE-046 WT:C MT53E2G32D4DE-046 WT:C is 64Gbit Parallel SDRAM - Mobile LPDDR4X Memory IC, p...
... (ICs) Logic & voltage translation Mfr Texas Instruments Series Transparent D-type Latches ICs Package Tray & Reel (TR) Part Status Active PLL Yes Main Purpose General purpose Operating Temperature -40°C ~...
...components to control system functions and operations. Our Electronic IC Chips are designed to meet the demands of a variety of applications, ranging from power management to signal processing and data stora...
...vinegar, rice wine and various liquids, the whole packaging process: film sterilization, bag making, printing date, filling, sealing, cutting, counting can be completed at one time. Heat sealing temperature ...
...vinegar, rice wine and various liquids, the whole packaging process: film sterilization, bag making, printing date, filling, sealing, cutting, counting can be completed at one time. Heat sealing temperature ...
...Packaging Machine Introduction of Liquid Multi Function Packaging Machine This equipment is widely used in packaging milk, soy milk, soy sauce, vinegar, rice wine and various liquids, the whole packaging pro...
... is a revolutionary product that is designed to streamline the packaging process for a variety of snack foods. With its advanced technology and user-friendly interface, this machine is perfect for packaging ...
... weighing technology, ensuring near-perfect portioning of products to meet the highest quality standards. One of the standout features of the Automated Packaging System is its high-speed packaging capabiliti...
Packaging furnace FSE-B Tubular Packaging Furnace upto 1100℃ used in silicon wafers of solar cells annealing Description: The glass packaging tubular quartz furnace is specially designed for the glass packaging...
... batch production of Kovar alloy micro oxidization and other materials, and the diffusion and annealing processes of solar cell wafers. ➢Characteristics: ◆Working temperature: R~1000℃. ◆Diameter of furnace t...
...Packaging Furnace (T max 1100℃) used in electronic packaging Description: The glass packaging tubular quartz furnace is specially designed for the glass packaging process, the small batch production of Kovar...
...Packaging Furnace (T max 1100℃) used in electronic packaging Description: The glass packaging tubular quartz furnace is specially designed for the glass packaging process, the small batch production of Kovar...