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Total 330 products for ic spec Manufacture & Suppliers

30W Uav Defense Amplification Module 300-400MHz Anti-Drone RF Ics Superior Factory-Strength Jamming Amplifiers With GAN And Isolation Protector

Product Parameters Main Components : 1, Adjustable Bandwidth 2, Adjustable Bandwidth 3, Adjustable Driver Tube Voltage 4, Tube Voltage 5, Adjustable GAN Voltage 6, GAN Voltage 1.RF Data Item Spec. Remarks Frequ...

JinYaTong Technology(china) Co., Ltd
Guangdong,China

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Low frequency power amplifier transistor JSMSEMI 2SD667A featuring DC current gain and voltage specs

Product Overview The 2SD667/A is a low frequency power amplifier designed as a complementary pair with the 2SB647/A. It offers robust performance with high breakdown voltages and reliable DC current gain charac...

Hefei Purple Horn E-Commerce Co., Ltd.
Anhui,China

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Hitachi brand BT material substrate manufacture

...IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electron...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Bright Gold 0.2mm Multilayer substrate Fabrication With AUS308 PSR

...,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electro...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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0.2mm 2 layer Memory Card substrate Fabrication For Capsulation

...UDP card,USB,Chip substrate ,IC assembly substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory sp...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation

Application:Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Semiconductor Package Substrate 12um copper buildup types

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finished

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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BT Memory Card BGA package Substrate 6 layer Immersion Gold

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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15.0 Inch 1024x768 BOE LCD Display

... Color Depth 16.7M Technology type a-Si Display Spec. Pixel pitch (mm) 0.099(H)×0.297(V) Pixel Configuration R.G.B. Vertical Stripe Display Mode Normally Black Driver IC OTA7290B CTP Driver IC - Viewing Dire...

Shenzhen Kadi Display Technology Co., Ltd
China

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IPS KADI 7 Inch Color TFT LCD Display RGB 280x1424 Dots MIPI Interface

... Color Depth 16.7M Technology type a-Si Display Spec. Pixel pitch (mm) 0.12(H)×0.12(V) Pixel Configuration R.G.B. Vertical Stripe Display Mode Normally Black Driver IC OTA7290B CTP Driver IC - Viewing Direct...

Shenzhen Kadi Display Technology Co., Ltd
China

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Real Time Digital X-Ray Machine AX7900 for Capacitor Inner Defects Inspection

...IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photov...

Unicomp Technology
Guangdong,China

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CE/FDA Certificated FPD 90KV X-ray Inspection System for Capacitor Defects Detecting

...IC X-Ray machine AX7900: Widely applied for BGA, CSP, PCB, Flip Chip, LED, Fuse, Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photov...

Unicomp Technology
Guangdong,China

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ICM-20602 Integrated Circuit Chip 6 - Axis Motion Tracking Device Sensitivity Error ±1%

ICM-20602 LGA-16 3-axis gyroscope, 3-axis accelerometer 6-Axis MotionTracking device Description The ICM-20602 is a 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, in a smal...

ChongMing Group (HK) Int'l Co., Ltd
China

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CM3202-00DE integrated circuit components Integrated Circuit Chip DDR VDDQ and Termination Voltage Regulator

DDR VDDQ and Termination Voltage Regulator Features �� Two linear regulators -Maximum 2A current from VDDQ -Source and sink up to 2A VTT current �� 1.7V to 2.8V adjustable VDDQ output voltage �� 500mV typical VDDQ...

ChongMing Group (HK) Int'l Co., Ltd
China

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NCP51561DBDWR2G onsemi

Here is the English information I found for the NCP51561DBDWR2G chip: NCP51561DBDWR2G is a synchronous buck DC-DC converter from ON Semiconductor. Some key specs and features: Input voltage range: 4.5V to 18V O...

ZhongHao Industry Limited
China

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NCP730BMT330TBG onsemi

Here are the key specs and features of the NCP718BSN250T1G MOSFET chip from ON Semiconductor: Breakdown Voltage: 25V On-Resistance: 0.25�� (typ) Continuous Drain Current: 7A Fast Switching Speeds PowerPAK SO-8 P...

ZhongHao Industry Limited
China

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Flash/NAND memory package substrate production

...,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Multilayer BT materials semiconductor package substrate manufacture

...,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: ...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Customized Ultrathin Rigid PCB Fabrication

...IC substrate Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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