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DP Intel Universal GPU System with NVIDIA HGX A100 4-GPU Key Applications: High Performance Computing, AI/Deep Learning Training, Key Features High density: Dual Socket P+ (LGA-4189) 3rd Gen Intel Xeon Scalab...
...270W, can support Montage processors Chipset Intel C621A memory 16/32 DDR4 memory slots, up to 3200MT/s; Up to 16 Intel ® Optane ™ persistent memory 200 series, up to 3200MT/s Local storage It supports a var...
...: Gaudi 2 Memory Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM Chipset Intel C621A BIOS Type AMI 32MB SPI Flash EEPROM Power Power-on mode for AC power recovery Power ......
...: Gaudi 2 Memory Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM Chipset Intel C621A BIOS Type AMI 32MB SPI Flash EEPROM Power Power-on mode for AC power recovery Power ......
... • 32 DDR4 DIMM slots, supports RDIMM 2 TB max or LRDIMM 8 TB max, speeds up to 3200 MT/s • Up to 16 Intel Persistent Memory 200 series (BPS) slots, 8 TB max • Supports registered ECC DDR4 DIMMs only Storage...
...; Use 32 128GB 3ds rdimms; Up to 16 Intel ® Ao Teng ™ Persistent memory 200 series module Drive Bay Front and rear drive bays, up to 4 3.5 inch + 2 2.5 inch ......
... RAID 730/8I/1GB CPU Up to 2 3rd generation Intel ® xeon ® Scalable processor platinum series, up to 40 cores, up to 270W TDP RAM 32 DDR4 memory sockets; Use 32 128GB 3ds rdimms; Up to 16 Intel ® Ao Teng ™ P...
... 32 128GB 3ds rdimms; Up to 16 Intel ® Ao Teng ™ Persistent memory 200 series module Drive Bay Front and rear drive bays, up to 4 3.5 inch + 2 2.5 inch ......
...; Use 32 128GB 3ds rdimms; Up to 16 Intel ® Ao Teng ™ Persistent memory 200 series module Drive Bay Front and rear drive bays, up to 4 3.5 inch + 2 2.5 inch ......
...; Use 32 128GB 3ds rdimms; Up to 16 Intel ® Ao Teng ™ Persistent memory 200 series module Drive Bay Front and rear drive bays, up to 4 3.5 inch + 2 2.5 inch ......
...; Use 32 128GB 3ds rdimms; Up to 16 Intel ® Ao Teng ™ Persistent memory 200 series module Drive Bay Front and rear drive bays, up to 4 3.5 inch + 2 2.5 inch ......
...; Use 32 128GB 3ds rdimms; Up to 16 Intel ® Ao Teng ™ Persistent memory 200 series module Drive Bay Front and rear drive bays, up to 4 3.5 inch + 2 2.5 inch ......
...; Use 32 128GB 3ds rdimms; Up to 16 Intel ® Ao Teng ™ Persistent memory 200 series module Drive Bay Front and rear drive bays, up to 4 3.5 inch + 2 2.5 inch ......
... 3rd generation Intel ® xeon ® Scalable processor platinum series, up to 40 cores, up to 270W TDP RAM 32 DDR4 memory sockets; Use 32 128GB 3ds rdimms; Up to 16 Intel ® Ao Teng ™ Persistent memory 200 series ...
... Factor/Height 2U rack/server Processors Up to 2 second-generation Intel® Xeon® Platinum processor, up to 205W Memory Up to 7.5TB in 24x DIMM slots using 128GB DIMMs and Intel® Optane™ DC Persistent Memory; ...
...Processor 2-4 3rd Generation Intel® Xeon® Scalable processor(s); Up to 28 cores (2.9GHz); Max. speed of 3.9GHz (8 cores); 6 UPI interconnected chains and up to 10.4GT/s per chain; Max. power of 250W. Chipset...
...: up to 8 cores(freq. 4.0GHz) TDP: up to 95W Chipset Intel C242/C246 Memory Up to 4 x DDR4 2666 MT/s memory Supporting UDIMM, up to 128GB (32GB per DIMM) Storage Hot-swappable: up to 4 x 3.5-......
...Description The dense and compact HPE ProLiant DL20 Gen9 Server, powered by the latest Intel® Xeon®, Intel Core™ i3, and Pentium®processors, blends enterprise-class capabilities with great value. Outstanding...
... Form Factor 2U Processor 2 x Intel® Xeon® Ice Lake scalable processors Memory Up to 16 x DDR4 3200 MT/s memories Up to 8 x Intel® OptaneTM PMem Storage Front: 24 x 2.5-inch SATA/SAS/NVMe SSDs (up to 12 x NV...
...: up to 8 cores(freq. 4.0GHz) TDP: up to 95W Chipset Intel C242/C246 Memory Up to 4 x DDR4 2666 MT/s memory Supporting UDIMM, up to 128GB (32GB per DIMM) Storage Hot-swappable: up to 4 x 3.5-......