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...mainboard chips. Place of Origin: TAIWAN Brand Name: Model Number: HYB18T512160AF-3 Type: IC Application: PCB Supply Voltage: V Dissipation Power: W Operating Temperature: C Date Code: 2009 Lead free status:...
... Temperature: C Date Code: 2009 Lead free status: RoHS compliant Package: Original package Over View The Northbridge typically handles communications among the CPU, in some cases RAM, and PCI Express (or AGP...
... Temperature: C Date Code: 2009 Lead free status: RoHS compliant Package: Original package Over View The Northbridge typically handles communications among the CPU, in some cases RAM, and PCI Express (or AGP...
... Temperature: C Date Code: 2009 Lead free status: RoHS compliant Package: Original package Over View The Northbridge typically handles communications among the CPU, in some cases RAM, and PCI Express (or AGP...
... Temperature: C Date Code: 2009 Lead free status: RoHS compliant Package: Original package Over View The Northbridge typically handles communications among the CPU, in some cases RAM, and PCI Express (or AGP...
...mainboard chips. Place of Origin: TAIWAN Brand Name: Model Number: HYB18T512161BC-3 Type: IC Application: PCB Supply Voltage: V Dissipation Power: W Operating Temperature: C Date Code: 2009 Lead free status:...
... mainboard chips. Place of Origin: TAIWAN Brand Name: Model Number: HYB18T512161BF-28 Type: IC Application: PCB Supply Voltage: V Dissipation Power: W Operating Temperature: C Date Code: 2009 Lead free statu...
...mainboard chips. Place of Origin: TAIWAN Brand Name: Model Number: HYB18T512161BF-3 Type: IC Application: PCB Supply Voltage: V Dissipation Power: W Operating Temperature: C Date Code: 2009 Lead free status:...
... Temperature: C Date Code: 2010 Lead free status: RoHS compliant Package: Original package Over View The Northbridge typically handles communications among the CPU, in some cases RAM, and PCI Express (or AGP...
... Temperature: C Date Code: 2011 Lead free status: RoHS compliant Package: Original package Over View The Northbridge typically handles communications among the CPU, in some cases RAM, and PCI Express (or AGP...
... Temperature: C Date Code: 2011 Lead free status: RoHS compliant Package: Original package Over View The Northbridge typically handles communications among the CPU, in some cases RAM, and PCI Express (or AGP...
... Temperature: C Date Code: 2009 Lead free status: RoHS compliant Package: Original package Over View The Northbridge typically handles communications among the CPU, in some cases RAM, and PCI Express (or AGP...
... US: sales@megasourceel.com Operating Temperature: STANDARD MFG PART NUMBER: 216DLP4BK22HG DATE CODE: 2004 PACKAGE: ORIGINAL PACKAGE LEAD TIME(Delivery Time): IN STOCK, SHIP WITHIN 1 DAY QUALITY WARRANTY: 90...
...CHIPS ORIGINAL NEW CONDITION 365 DAYS WARRANTY Detailed Product Description Commdity: GDM7243SB10CGT Lead Time: 2-3 DAYS Package: Standard Packaging Warranty: 365 Days Shipping Ways: China Post/DHL/FEDEX/UPS...
... CER1uF 50V 10% 1206 X7R Lead Free Status / RoHS Status Lead free / RoHS Compliant Packaging Tape & Reel (TR) Application General Purpose Capacitance 1uF Tolerance ±10% Rated Voltage 50V Temperature Coeffici...
...package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm Hermeticity: leak rate ≤1x10-3Pa.cm3/s (He) Insulation resistance: ≥1000MΩ (DC500V) Pin ...
...package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm Hermeticity: leak rate ≤≤1x10-3Pa.cm3/s (He) Insulation resistance: ≥1000MΩ (DC500V) Pin...
...package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm Hermeticity: leak rate ≤≤1x10-3Pa.cm3/s (He) Insulation resistance: ≥1000MΩ (DC500V) Pin...
...package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm Hermeticity: leak rate ≤≤1x10-3Pa.cm3/s (He) Insulation resistance: ≥1000MΩ (DC500V) Pin...
...package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm Hermeticity: leak rate ≤≤1x10-3Pa.cm3/s (He) Insulation resistance: ≥1000MΩ (DC500V) Pin...