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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
...LED CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 5454 SERIES 150W+150W Dual color temperature 2700K/6500K 90/120 3A 51-53V 54X54MM 40MM 120° 95 Two-color mirr...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
...LED CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 5454 SERIES 150W+150W Dual color temperature 2700K/6500K 90/120 3A 51-53V 54X54MM 40MM 120° 95 Two-color mirr...