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100W-126W UVA LED SMD LED COB 1616 3535 8025 365nm 405nm 395nm 13-56v 3D printer UV curing UV-A POWER Dominant ......
Product Descriptions Power 15W;20W;30W;25W CCT WW:2700-3000K; NW:4000-4500K; PW:6000-6500K. Current 300mA;600mA;750mA;900mA Design Advantage 1,No glare light 2,Color consistance 3,Low life decay 4,Low thermal r...
COB 1917 18W/24W/48W/60W 36V Warm and Cool White LED CHIP For Indoor / Outdoor Lighting 1919 Series Item Size Les(Dia) Power S&P VF IF LM/W CRI HY-1917-18W 19*19mm 17mm 18W 12S3P 36-39V 450mA White 150-160LM/W(...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Photography lights CHIPS 250W 620nm/460nm/520nm/2700K/6500K 140LM/W 24*5A 24-26V With Lighting LED CHIP products Specification: Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-leve...
Models LN-CAS38XW-P100-30 LN-CAS38XW-P200-30 Electronic power 100W 200w-300W Color temperature WW:2700-3000K; NW:4000-4500K; PW:5000-6000K WW:2700-3000K; NW:4000-4500K; PW:5000-6000K VF 54-58V 54-58V IF 1800mA ...
Design Advantage : 1,No glare light 2,Color consistance 3,Low life decay 4,Low thermal resistance 5,High CRI 80/90/95+ 6,High standard raw materials proovide Product Specifications Models LN-CAS19XW-P16-17 LN...
Product Specifications Models LN-CAS14XW-P20-11 LN-CAS14XW-P20-11 Electronic power 20W 20W Color temperature WW:Warm white=2800-3200K NW:Neutral white=4000-4500K PW:Pure white=6000-7000K WW:Warm white=2800-3200...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
... Garden Plant Light Product Description Item CL-34.85*34.85/32 cob led chips Power 80W Current 2000-2100mA light color Full spectrum Lumens 150-160lm/W Chip Brand US Bridgelux Warranty 3 years Applications T...
DOB Full spectrum LED CHIP 220V 50W for Growth light AC90-140V with driver on board 380-800nm with CE RoHS Product Information Product Item 70*50*1.6/25*25mm Chip Matrial US Bridgelux Power 50W Current 150MA Li...
DOB Full spectrum LED CHIP 220V 50W for Growth light AC90-140V with driver on board 380-800nm with CE RoHS Product Information Product Item 70*50*1.6/25*25mm Chip Matrial US Bridgelux Power 50W Current 150MA Li...
...LED 23-26V 395nm 86000-100000mW high power uv led with low thermal resistance UVA SMD LED Product Specifications models LN-CVB75UV-P84 Dominant Wavelength 395nm Lighting Area 40*20MM Circuit 7S12P VIEW ANGLE...
7530 UVA LED 23-26V 395nm 86000-100000mW high power uv led with low thermal resistance Product Specifications models LN-CVB75UV-P84 Dominant Wavelength 395nm Lighting Area 40*20MM Circuit 7S12P VIEW ANGLE 30° C...
Efficacy of 160 lm/W typical for 3000K, 80CRI Compact high flux density light source Uniform, high quality illumination Minimum 70, 80, and 90 CRI options StreaCLined thermal path ENERGY STAR / ANS...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...