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UV Protected Full Color LED Display Module Waterproof With Epistar Chip 1. Features : 1) Taiwan Epistar LED chip 2) A-class LED display module frame and mask, which could endual harsh weather. 3) Fiberglass gre...
ADM3483EARZ 3.3 V, 15 kV ESD-Protected, Half- and Full-Duplex, RS-485/RS-422 Transceivers GENERAL DESCRIPTION The ADM3070E to ADM3078E are 3.3 V, low power data transceivers with 15 kV ESD protection suitable...
... Circuit Board Chips Electronic Ic Chip Color TV Ic chip ic diode CMOS PROGRAMMABLE PERIPHERAL INTERFACE FEATURES: • High speed and low power consumption due to 3m silicon gate CMOS technolog y • 3 V to 6 V ...
...Chip TK5244 for Kyocera ECOSYS M5526cdw M5526cdn P5026cdw P5026cdn Printer Color Chips TK-5244 TK5240 TK5242 TK-5240 TK-5242 Product Details Description: Toner Chip Part Number: TK-5244 TK5244 TK5240 TK5242 ...
... LED chip that combines the benefits of red, green, and blue color diode chips in a compact package size of 15mm X 15mm. With a voltage range of 1.5-5V, this RGB LED Chip offers flexibility in powering optio...
Full Automatic Fresh Frozen French Fries Production Line Machine Potato Chips Machine For Factory Plan We are not only selling machines, but we can also tailor a set of potato chip production investment solutio...
Full Automatic Fresh Frozen French Fries Production Line Machine Potato Chips Machine For Factory Plan We are not only selling machines, but we can also tailor a set of potato chip production investment solutio...
...Chips, CRI 80, 120°View, RoHS Compliant, Corrosion Resistant 10W 1313 COB Led Chips Details Features * Dimension 13.50mm×13.50mm×1.5mm * Available CRI: 70, 80, 90, 95, 97, 98 * Wide CCT Range:1700-20000K * R...
FSB-G41V2NA Full-size Motherboard, Intel@ G41 Chip, 2LAN/2COM/8USB Feature ■ Support Intel® LGA775 Core™ 2 Quad/Core™ 2 Duo Processor ■ 2 Gigabit LAN ■ VGA ......
FSB-B75V2NA Full-size Motherboard, Intel@ PCH B75 Chip, 2LAN/2COM/8USB Feature Support LGA1155 socket for 2nd/3rd Gen. Intel CoreProcessor 2 Gigabit LAN VGA Graphics Interface 2COM RS232 8USB2.0 25...
FSB-945V2NA Full-size Motherboard, Intel@ 945GC Chip, 2LAN/2COM/6USB Feature ■ Support Intel® LGA775 Core™ 2 Duo/Pentium 4/D Processor ■ 2 Gigabit LAN ■ VGA Graphics ......
.../ Full Auto INLAY Sheet Chip Fixation Hole Die Cutting Machine YHP-FA-1H 1.Introduction of Full Auto Speedy INLAY Sheet Hole Puncher YHP-FA-1H Full Auto Speedy INLAY Sheet Hole Puncher YHP-FA-1H is designed ...
12 Sport Wall Mounted Outdoor Full Color Led Display ,Epistar + silan Chip IP67 Specifications: Product model number Mled-PH12-1 1.Pixel Pixel L ED 348 Pixel Configuration 1 R, 1G , 1B ......
outdoor P3.91 P4 P4.81 P5 P6 hot selling full color SMD Epistar chip led display Features 1. Light and slim cabinet allows quick build screen in short time. 2. Die-cast aluminum ......
... SMD Indoor Full Color LED Display screen high refresh rate Competitive Advantages: 1. P5 SMD outdoor full color LED display uniform in brightness and color; 2. Full color P5 LED screen is utilizing full bla...
...chip 6000K Aluminum AC LED COB 30W 50W 220V high efficiency 900-100lm/w 4060 COB LED Chip Main Features: 1.220V-240V directly applicaton. 2. With smart IC to control over voltage or current, to protect the L...
...Chip High Power led cob full spectrum 100W LED COB models LN-AFR110FS-P100AC-50H Electronic power 100W Color temperature 380-780nm VF AC220V±10V IF 0.45A Circuit 81S2P(F2235 CHIP) WHOLE SIZE R110mm EMIT SIZE...
...(F2235 CHIP) WHOLE SIZE 40*60mm EMIT SIZE 25x25MM Power Efficacy >0.85 Design Advantage : Epistar & Epiled chip. Low thermal resistance <0.58C/W. Multi wavelength. Various spectrum. Driver & LED all in one design. Q1: Do you supply OEM,ODM ......
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...