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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
2100W Multi Purpose COB LED Chip 8598 RGBCW Professional-grade COB LED chip enabling endless color possibilities with strong illumination for events and stage lighting applications. Product Features 2100W high-...
...Lights With Air For Rigging Install Artemis Daylight Tungsten Hybrid Balloons Film Lighting Balloon with Air for Rigging Install Artemis Daylight Tungsten Hybrid Balloons Film Lighting Balloon with Air for R...
...set lighting (fill or main) as a high quality softened light source with its high pwer high output and unmatchable performance. The lighting balloons are able to create amazing lighting that a conventional l...
PRO 2000W TV and Photograph Studio Customized Artemis lighting balloon The lighting balloons are widely used in set lighting (fill or main) as a high quality softened light source with its high pwer high output...
...high pwer high output and unmatchable performance. The lighting balloons are able to create amazing lighting that a conventional lighting could unsatisfactorily to deliver. Data sheets Regulation type consta...
...Lighting Inflatable Tubular LED 1.8kw Movie Light Our balloon lights include LED, HMI, tungsten, hybrid, sodium vapor, and metal halide. Our Tube-shaped LED balloon lights are uniquely designed to elevate yo...
...laser goes through the skin surface to reach the root of hair follicle; light can be absorbed and converted into heat damaged hair follicle tissue, so that hair loss regeneration without injury surrounding t...
3.0x 52mm Digital Telephoto Macro Lens AF 70mm X 65 Mm External Light Size Product Name: Digital Optic 3.0X Super High-Definition Telephoto AF 52mm Lens Camera Lens Product ......