| Sign In | Join Free | My burrillandco.com |
|
...Thermal Insulation Materials Thermal Gap Filler For Effective Heat Transfer In Electrical Applications The TIS™100-05 Series products are the high-efficiency insulation ones with thermal conduction propertie...
...Thermal Conductive Gap Filler Pad For Video Capture Board Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the resea...
... thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. ...
... that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing ...
... powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features: > Good th...
...Conductive Insulation Thermal Pad Adhesion Thermal Conductive Silicone Pad The TIF160-07E Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy....
...Thermally Conductive Potting Compound 1 1 Mix Ratio for Capacitors and Electrical Devices Product Description: Product Summary: The Thermal Conductive Potting Compound is a high-quality heat dissipation pott...
...Thermally Conductive Potting Compound: HN-8820 RTV potting gel offers V-0 flame retardancy and reliable performance from -40°C to 150°C. It ensures long-term durability for demanding applications. Performanc...
... High Thermal Conductive Pad 2.95 g / cc Specific Gravity 2.0W/mK The TIF100-40-05S is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the mat...
...components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Their flexibility and elasticity make them suited to the coating o...
...Thermal Conductivity Low Melting PCM Thermal Interface Material for Netbook and Desktop Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface mat...
... retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. TIF700Z-Series-Datasheet(E)-REV01.pd...
.... TIG™780-38 is a heat conducting product in the shape of paste.They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dis...
... issues. TIG™780-12 is a heat conducting product in the shape of paste. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the ...
... is a heat conducting product in the shape of paste.They serve to moisten the contact surface sufficiently so as to forman interface of extremely low thermal impedance.Consequently, the heat dissipation effi...
...Thermal Conductive Heatsink Paste Thermal Grease The TIG™780-25 is environmentally safe silicone-based thermal grease designed to solve overheating and reliability issues. TIGTM780-25 is presenting thermal p...
...Thermal Insulated Gap Pad For Gpu Laptop With High Temperature Resistance And 2.0W/M-K Thermal Conductivity Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. ...
...Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Interface Material Products Description TIF®500-50-10US Series is an ultra-soft thermal interface material designed specifically to protect precision compo...
...Thermal Conductivity Rating Of 10.0W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. I...