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...Thermal Pad Thermally Conductive Silicon Protective Cushioning Material The TIF®500-20-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are ex...
...Thermal Conductivity Die Cut Silicon Thermal Pad for AI Processors AI Servers The TIF®700PU Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitiv...
Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive The TIF®100 3030-06 Series is an ultra-soft thermal interface material designed specifically to protect precision c...
...Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI The TIF®100-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision...
... in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal ...
...ts High Thermal Conductivity 3w Thermal Conductive Silicone Pad The TIF140-30-15ESeries is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the...
...Thermally Conductive Silicone Adhesive TIS™580-20 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards el...
...Thermally Conductive Gap Filler Pads For 5G Aerospace AI Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the resear...
...good thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate therm...
... thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal p...
...Thermal Conductive Heatsink Silicone Gap Interface Pad A-gapfill 200 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W...
Thermal Conductive Silicone Pad Use In Electronic Product Silicone Rubber Sheet A-gapfill 200 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal...
... It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra lo...
...reliability issue. TIG™780-25 is presenting thermal paste products. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance. Consequently, the hea...
...Conductive Insulation Thermal Pad Adhesion Thermal Conductive Silicone Pad The TIF160-07E Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy....
...Thermally Conductive Potting Compound: HN-8820 RTV potting gel offers V-0 flame retardancy and reliable performance from -40°C to 150°C. It ensures long-term durability for demanding applications. Performanc...
.... TIG™780-38 is a heat conducting product in the shape of paste.They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dis...
... issues. TIG™780-12 is a heat conducting product in the shape of paste. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the ...