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Product Description Low Viscosity Potting Silicone HN-8806A/B – For Power Modules, LED Drivers, Transformers Product Overview Low Viscosity Potting Silicone HN-8806A/B – For Power Modules, LED Drivers, Transfor...
Low Viscosity Silicone Potting Compound For Deep Filling Of Complex Electronic Parts Product Overview for silicone potting compound: HN-8806 is a two-component addition cure silicone potting compound, curable a...
... Driver PCB Protection HN-8820-IND is a low-viscosity two-part addition-cure silicone potting compound specifically formulated for EV charging pile power modules, high-power LED ......
Low Viscosity Electronic Silicone Gel for EV Battery and Pressure Sensor Potting This electronic-grade silicone gel is a highly elastic liquid silicone rubber that cures via cross-linking reaction into a soft, ...
...-making silicone supplied as HN-E610 in the HN-E6XX series by a direct China manufacturer, Shenzhen Hanast New Materials Co., Ltd. Its low viscosity gives excellent flow for capturing intricate surface detai...
... transparent platinum cure liquid silicone rubber with low viscosity, engineered for food-grade chocolate and candy casting molds. The simple 1:1 mixing ratio and low-viscosity flow ensure faithful reproduct...
HANAST HN-8808AB Low Viscosity RTV Silicone Potting Compound for Sensor and Automotive ECU HN-8808AB is a low-viscosity, two-component condensation-cure RTV-2 silicone potting compound supplied in a 10:1 ratio....
...Low Viscosity AB Glue for Narrow Gap Electronic Component Encapsulation HN-5506A/B is a clear two-component epoxy potting compound with a 2:1 mix ratio, specially formulated for narrow gap and fine clearance...
Low Viscosity Silicone Potting Compound 1:1 Deep Section Waterproof for Electronic Components This two-component addition-cure silicone potting compound features a low-viscosity, high-flowability formulation th...
...Low Viscosity Thermally Conductive Black Epoxy Potting Compound for Power Module and Automated Dispensing Encapsulation HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound...
...low viscosity, UV curable adhesive for glass, plastic, and metal bonding, suitable for mechanical dispenser. Medical certification passed ISO-10993. Technical Data Item Unit Typical Value Color Component A A...
...Glass/Metal, Especially for PMMA bonding Property before curing: Appearance: Amber Liquid Density (g/cc): 1.05 Viscosity (mPa*25C): 600—1000 Main Material: Modified Acrylate Curing Situation: Request Lamp In...
...low viscosity, surface-insensitive, universal cyanoacrylate. Typical Application Bonding of porous, acidic, and absorbent inert materials. Properties before curing Typical Value Range Appearance Colorless tr...
High solids and low viscosity polyamide curing agent HW-503 suitable for coal tar epoxy system coating materials Polyamide Epoxy Resin HW-503 is a low molecular weight polyamide curing agent with high solids an...
Low Viscosity Modified Aliphatic Polyamine Epoxy Curing Agent D1638 1, General Description D1638 is a modified aliphatic polyamine epoxy curing agent with low viscosity, high reactivity and low loading.it has h...
Low Viscosity Amidoamine Curing Agent Epoxy Hardener Ancamide 502 1, General Description: Ancamide 502 Low Viscosity Amidoamine Curing Agent for use with epoxy resins in two part ambient cure coatings. Special ...
VOC Coatings Low-Viscosity Ketimine Curing Agent Ancamine 2458 1, General Description: Ancamine 2458 curing agent is a low-viscosity ketimine curing agent recommended for low volatile organic compound (VOC) coa...
Low Viscosity Modified Aliphatic Amine Use With Liquid Epoxy Resin Equal to Curing Agent ANCAMINE 1638 1, General Description: D1638 is a modified aliphatic polyamine epoxy curing agent with low viscosity , hig...
VOC Coatings Low-Viscosity Ketimine Curing Agent Ancamine 2458 1, General Description: Ancamine 2458 curing agent is a low-viscosity ketimine curing agent recommended for low volatile organic compound (VOC) coa...
Low Viscosity Modified Aliphatic Polyamine Epoxy Curing Agent D1638 1, General Description D1638 is a modified aliphatic polyamine epoxy curing agent with low viscosity, high reactivity and low loading.it has h...