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Memory IC Chip S70KS1282GABHA023 200MHz Pseudo SRAM Memory IC 24-FBGA Product Description Of S70KS1282GABHA023 S70KS1282GABHA023 The DRAM array appears to the host as though the memory uses static cells that r...
Memory IC Chip MT53E1G64D4HJ-046 AAT:A Automotive 64G LPDDR4 Memory IC Product Description Of MT53E1G64D4HJ-046 AAT:A MT53E1G64D4HJ-046 AAT:A is a high-speed CMOS dynamic random access memory. LPDDR4 memory is ...
...Memory IC Chip 128Mb 40MHz Serial Configuration Flash Memory SOIC-16 Product Description Of EPCS128SI16N EPCS128SI16N device is a 128Mb 40MHz Serial Configuration flash memory device that can store configura...
...Recovery The KUKA Robot Controller series, such as the KRC4, relies on precise programming data and system configurations. By integrating USB 4.0 drives (with transfer speeds up to 40 Gbps) into backup and r...
KMQE60013B-B318 SAMSUNG Multi-Chip Package Memory (MCP) Product Technical Specifications EU RoHS Supplier Unconfirmed Part Status Active Automotive No PPAP No...
MT40A512M16LY-075-E Original DRAM DDR4 8G 512MX16 FBGA Memory Data Storage Features VDD = VDDQ = 1.2V 60mV VPP = 2.5V, 125mV, +250mV On-die, internal, adjustable VREFDQ generation 1.2V pseudo open-dra...
KMQE60013B-B318 SAMSUNG Multi-Chip Package Memory (MCP) Product Technical Specifications EU RoHS Supplier Unconfirmed Part Status Active Automotive No PPAP No...
MT40A512M16LY-075-E Original DRAM DDR4 8G 512MX16 FBGA Memory Data Storage Features VDD = VDDQ = 1.2V 60mV VPP = 2.5V, 125mV, +250mV On-die, internal, adjustable VREFDQ generation 1.2V pseudo open-dra...
..., Toshiba, Micron, Hynix, Sandisk and Intel. 100% FULL CAPACITY is guarantee. PCBA inside: PCBA Specification: 1) Memory Available: 1/2/4/8/16/32/64GB. 2) Interface: USB 2.0. 3) Data Retention: At least 10 y...
... use Samsung, Toshiba, Micron, Hynix, Sandisk and Intel. All our chip is FULL CAPACITY. PCBA inside: PCBA Specification: 1) Memory Available: 8/16/32/64GB. 2) Interface: USB 3.0. 3) Data Retention: At least ...
... use Samsung, Toshiba, Micron, Hynix, Sandisk and Intel. All our chip is FULL CAPACITY. PCBA inside: PCBA Specification: 1) Memory Available: 8/16/32/64GB. 2) Interface: USB 3.0. 3) Data Retention: At least ...
...Toshiba, Micron, Hynix, Sandisk and Intel. 100% FULL CAPACITY is guarantee. PCBA Specification: 1) Memory Available: 1/2/4/8/16/32/64GB. 2) Interface: USB 2.0. 3) Data Retention: At least 10 year, 100 thousa...
...memory stick. 2. Any logo can be done. 3. Multi capacity. 4. Fast data transfer speed. What is important inside Usb 3.0 Flash Drive? Memory Chip. We use Samsung, Toshiba, Micron, Hynix, Sandisk and Intel. Al...
...memory stick. 2. Any logo can be done. 3. Multi capacity. 4. Fast data transfer speed. What is important inside Usb 3.0 Flash Drive? Memory Chip. We use Samsung, Toshiba, Micron, Hynix, Sandisk and Intel. Al...
...memory stick. 2. Any logo can be done on product. 3. Multi capacity. 4. Multi colors. What is important inside Usb Flash Drive? Memory Chip. Brand such as Samsung, Toshiba, Micron, Hynix, Sandisk and Intel. ...
... use Samsung, Toshiba, Micron, Hynix, Sandisk and Intel. All our chip is FULL CAPACITY. PCBA inside: PCBA Specification: 1) Memory Available: 8/16/32/64GB. 2) Interface: USB 3.0. 3) Data Retention: At least ...
... use Samsung, Toshiba, Micron, Hynix, Sandisk and Intel. All our chip is FULL CAPACITY. PCBA inside: PCBA Specification: 1) Memory Available: 8/16/32/64GB. 2) Interface: USB 3.0. 3) Data Retention: At least ...
...memory stick. 2. Any logo can be done. 3. Multi capacity. 4. Fast data transfer speed. What is important inside Usb 3.0 Flash Drive? Memory Chip. We use Samsung, Toshiba, Micron, Hynix, Sandisk and Intel. Al...
...Samsung, Toshiba, Micron, Hynix, Sandisk and Intel. All our chip is FULL CAPACITY. PCBA Specification: 1) Memory Available: 8/16/32/64GB. 2) Interface: USB 3.0. 3) Data Retention: At least 10 year, 100 thous...
...memory stick. 2. Any logo can be done. 3. Multi capacity. 4. Fast data transfer speed. What is important inside Usb 3.0 Flash Drive? Memory Chip. We use Samsung, Toshiba, Micron, Hynix, Sandisk and Intel. Al...