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Printed Circuit Boards 14 Layer PCB FR4 Substrate Material Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 Min Tg: 170DEG...
Printed Circuit Boards 4 Layer PCB In Red Solder Mask And OSP Treatment Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per ......
Printed Circuit Boards 6 Layer PCB Middle TG Degree FR4 Material Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per ......
Printed Circuit Boards 8 Layer PCB 1.6 MM Finished Board Thickness Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or ......
2 OZ Copper 2 Layer PCB Photovoltaic Inverter Used Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 ......
2 W/MK Conductivity Aluminum Substrate Single Layer PCB Used In Led Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: Aluminum 3.2 Min Tg: 150DEG 3.3 ......
3 W/MK Conductivity Copper Substrate Single Layer PCB Used In Led Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: Aluminum 3.2 Min Tg: 150DEG 3.3 ......
2 W/MK Conductivity Aluminum Substrate Single Layer PCB Used In Led Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: Aluminum 3.2 Min Tg: 150DEG 3.3 ......
2 OZ Copper 2 Layer PCB Photovoltaic Inverter Used Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 ......
2 W/MK Conductivity Aluminum Substrate Single Layer PCB Used In Led Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: Aluminum 3.2 Min Tg: 150DEG 3.3 ......
3 W/MK Conductivity Copper Substrate Single Layer PCB Used In Led Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: Aluminum 3.2 Min Tg: 150DEG 3.3 ......
2 W/MK Conductivity Aluminum Substrate Single Layer PCB Used In Led Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: Aluminum 3.2 Min Tg: 150DEG 3.3 ......
Printed Circuit Boards 14 Layer PCB FR4 Substrate Material Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 Min Tg: 170DEG...
Printed Circuit Boards 4 Layer PCB In Red Solder Mask And OSP Treatment Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per ......
Printed Circuit Boards 6 Layer PCB Middle TG Degree FR4 Material Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per ......
Printed Circuit Boards 8 Layer PCB 1.6 MM Finished Board Thickness Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or ......
Multi-Layer Tray High Capacity Hot Air Oven Dryer For Bulk Materials hot air circulation oven Product Description The ......
Hot Sale Multi-Layer Electric Rotary Vibrating Sieve Vibrating Sifter for Silica Sand Xinxiang Dayong Vibration Equipment Co., Ltd. is a international manufacturing factory with research and development, design...
Rotating Vibrating Screen for Removing Impurities Magnetic Traps Multi-Layer Magnetic Rods Product Description Manual magnetic trap Manual magnetic trap is an important industrial equipment. It is mainly used t...
Multi Layers Copper Lab Test Sieve/Stainless Steel Test Sieve Product Description Laboratory vibrating screen is a standard analysis sieve integrating powder grading and liquid filtration; it is suitable for ac...