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06035C102K4T2A SMD Chip Capacitor 1000pF ±10% 50V Ceramic Capacitor X7R 0603 GENERAL DESCRIPTON AVX Corporation has supported the Automotive Industry requirments for Multilayer Ceramic Capacitors consistently f...
0402 0.20pF-220pF 16V 25V 50V SMD/SMT GRM Serial SMD Chip Capacitors Multilayer Ceramic Capacitor MLCC Model number Contact 86- 15102073750 please Rated Voltage 6.3v 10v 16v 25v 35v 50v 1kv Capacitance 102 103 ...
PMK325AC6337MM-P, CAP, 330uF, 2.5V, ±20%, X6S(EIA), 1210 Multilayer Ceramic Capacitors (High dielectric type) Ceramic Chip Capacitor MLCC chip capacitor IC electronics components Detailed Specifications : Packa...
...Multilayer Ceramic Capacitor Multi Layer Chip Capacitors Standard Technical Specifications : Capacitance: 10000000PF(pF) Tolerance (+ or -): 10% Rad Hardened: No Packaging: Tape and Reel Voltage: 50VDC Temp ...
... Hardened: No Failure Rate: Not Required Construction: SMT Chip Voltage: 6.3VDC Capacitance: 100000000PF(pF) Tolerance (+ or -): 20% Temp Coeff (Dielectric): X5R Wire Form: Not Required Mounting ......
... X6S Technology Standard Microwave Application No Construction Flat Termination Style Pad Number of Terminals 2 Case Style Ceramic Chip Size (mm) 3.2 X 1.6 X 1.6 Package/Case 1206 Minimum Operating Temperatu...
Smd Chip Mlcc Capacitors CL05A105KA5NQNC 1uF+/-10% 25V X5R 0402 PRODUCT DESCRIPTION Multilayer Ceramic Capacitors MLCC - SMD/SMT 1uF+/-10% 25V X5R 10 0402 PRODUCT PROPERTIES Manufacturer: Samsung Electro-Mechan...
Smd Chip Mlcc Capacitors CL10A335KP8NNNC 3.3uF+/-10% 10V X5R 0603 PRODUCT DESCRIPTION Multilayer Ceramic Capacitors MLCC - SMD/SMT 3.3uF+/-10% 10V X5R 0603 PRODUCT PROPERTIES Manufacturer: Samsung Electro-Mecha...
...+/-20% 25V X5R 2 0805 SMD Chip Capacitor PRODUCT DESCRIPTION Multilayer Ceramic Capacitors MLCC - SMD/SMT 22uF+/-20% 25V X5R 2 0805 PRODUCT PROPERTIES Manufacturer: Samsung Electro-Mechanics Product Category...
GRM2195C1H682JA01D MLCC 6800PF 50V 5% 0805 SMD Chip Capacitor Murata PRODUCT DESCRIPTION Multilayer Ceramic Capacitors MLCC - SMD/SMT 6800PF 50V 5% 0805 PRODUCT PROPERTIES Manufacturer: Murata Product Category:...
... X6S Technology Standard Microwave Application No Construction Flat Termination Style Pad Number of Terminals 2 Case Style Ceramic Chip Size (mm) 3.2 X 1.6 X 1.6 Package/Case 1206 Minimum Operating Temperatu...
...Multilayer Ceramic Capacitor Multi Layer Chip Capacitors Standard Technical Specifications : Capacitance: 10000000PF(pF) Tolerance (+ or -): 10% Rad Hardened: No Packaging: Tape and Reel Voltage: 50VDC Temp ...
... Hardened: No Failure Rate: Not Required Construction: SMT Chip Voltage: 6.3VDC Capacitance: 100000000PF(pF) Tolerance (+ or -): 20% Temp Coeff (Dielectric): X5R Wire Form: Not Required Mounting ......
PMK325AC6337MM-P, CAP, 330uF, 2.5V, ±20%, X6S(EIA), 1210 Multilayer Ceramic Capacitors (High dielectric type) Ceramic Chip Capacitor MLCC chip capacitor IC electronics components Detailed Specifications : Packa...
0402 0.20pF-220pF 16V 25V 50V SMD/SMT GRM Serial SMD Chip Capacitors Multilayer Ceramic Capacitor MLCC Model number Contact 86- 15102073750 please Rated Voltage 6.3v 10v 16v 25v 35v 50v 1kv Capacitance 102 103 ...
SMD1206 0402 0603 0806 The Ceramic Micro-Surge Protection Device (CMS) is manufactured from semiconducting ceramics which offer rugged protection and excellent transient energy absorption in a small SMD package...
SBL Series Surface mount multi layer chip beads,Large current EMI passive component multilayer SMD chip ferrite bead Features: Multilayer structure Closed magnetic circuit Avoids crosstalk Excellent magnetic sh...
MF52-103F3435 DIP Metal Oxide Varistors Negative Temperature Coefficient MF52A Pearl-Shape thermistor NTC 10K B value 3435 accuracy 1% length 30M Metal Oxide Varistors: Thermistor is a ceramic semiconducting el...
14D471K Bourns 430pF Metal Oxide Varistors DIP2 470Volts 14mm 50A Details: Manufacturer: Bourns Product Category: Varistor RoHS: Details Series: MOV - 14 DXXXK Products: MOV Mounting style: PCB MOUNT Type of e...
...Multilayer Capability Quick Changeover IC Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision sys...