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high purity 99.95% molybdenum crucible for vacuum coating Products detail: Purity(%) Ag Ni P Cu Pb N <0.0001 <0.0005 <0.001 <0.0001 <0.0001 <0.002 Si Mg Ca Sn Ba Cd <0.001 <0.0001 <0.001 <0.0001 <0.0003 <0.001 Na C Fe O H Mo <0.0024 <0.0033 <0.0016 <0.0062......
... Body Depth: 0.28 inch Body Length: 0.315 inch Connector Type: BOARD CONNECTOR Contact Finish Mating: SN ON NI Contact Finish...
... Insulation Resistance 1000 MΩ Min Operation Temperature -40℃ to 105℃ Contact Material Coppy Alloy Contact Plating Au or Sn Over Ni Insulator Material PA6T+30 GF(UL94-V0) Mounting Type Through Hole Terminati...
... Insulation Resistance 1000 MΩ Min Operation Temperature -40℃ to 105℃ Contact Material Coppy Alloy Contact Plating Au or Sn Over Ni Insulator Material PA6T+30 GF(UL94-V0) Mounting Type Through Hole Terminati...
99.95% Purity Molybdenum loop bright molybdenum ring Products detail: Purity(%) Ag Ni P Cu Pb N <0.0001 <0.0005 <0.001 <0.0001 <0.0001 <0.002 Si Mg Ca Sn Ba Cd <0.001 <0.0001 <0.001 <0.0001 <0.0003 <0.001 Na C Fe O H Mo <0.0024 <0.0033 <0.0016 <0.0062 <0.......
...5m,can be customize Copper + Silver CuAg: ≥99.85 Tin Sn: ≤0.01 Lead Pb: ≤0.005 Lead Pb: ≤0.005 Boron P: 0.013~0.050 Nickel Ni: ≤0.01 Iron Fe: ≤0.05 Beryllium Sb: ≤0.002 Sulfur S: ≤0.005 Arsenic As: ≤0.005 Bi...
... Y4 390-510 more than 40 100-160 Y2 490-610 more than 30 150-205 GB Chemical Composition(%) Sn Al Zn Fe Pb Ni P Cu C5191 6.0-7.0 0.002 0.3 0.05 0.02 0.2 0.10-0.25 Balance...
... (Sn) Layers Single-sided, double-sided, multilayer Copper Thickness 1 OZ-2OZ Board Thickness 0.4mm-3.2mm Min Hole Size 0.......
... Sn<0.0002 Mn Sb<0.0005 P<0.001 Cd<0.0003 Specification: 1) Purity:99.95%(min) 2) melting point:2622 ......
..., electronics Grade Impurities PPM Max Ir >99.98% Pt Pd Rh Ru Au Ag Cu Ni Fe Pb 11 2 24 7 1 2 2 1 18 3 Si Sb Cr Sn Ti Zn Cd Ca 6 3 4 3 2 24 2 3 Packaging...
... Insulation Resistance 1000 MΩ Min Operation Temperature -40℃ to 105℃ Contact Material Coppy Alloy Contact Plating Au or Sn Over Ni Insulator Material PA6T+30 GF(UL94-V0) Mounting Type Through Hole Terminati...
... Insulation Resistance 1000 MΩ Min Operation Temperature -40℃ to 105℃ Contact Material Coppy Alloy Contact Plating Au or Sn Over Ni Insulator Material PA6T+30 GF(UL94-V0) Mounting Type Through Hole Terminati...
... Insulation Resistance 1000 MΩ Min Operation Temperature -40℃ to 105℃ Contact Material Coppy Alloy Contact Plating Au or Sn Over Ni Insulator Material PA6T+30 GF(UL94-V0) Mounting Type Through Hole Terminati...
... ,2.0mm ,2.5mm ,2.8mm Number of Pin 1~40pin,2~80Pin Contact Material: Brass Contact Plating: Gold (Au) or Tin (Sn) Plated over Nickel (Ni) Insulator...
... ,2.0mm ,2.5mm ,2.8mm Number of Pin 1~40pin,2~80Pin Contact Material: Brass Contact Plating: Gold (Au) or Tin (Sn) Plated over Nickel (Ni) Insulator...
... Insulation Resistance 1000 MΩ Min Operation Temperature -40℃ to 105℃ Contact Material Coppy Alloy Contact Plating Au or Sn Over Ni Insulator Material PA6T+30 GF(UL94-V0) Mounting Type Through Hole Terminati...
... Insulation Resistance 1000 MΩ Min Operation Temperature -40℃ to 105℃ Contact Material Coppy Alloy Contact Plating Au or Sn Over Ni Insulator Material PA6T+30 GF(UL94-V0) Mounting Type Through Hole Terminati...
... Insulation Resistance 1000 MΩ Min Operation Temperature -40℃ to 105℃ Contact Material Coppy Alloy Contact Plating Au or Sn Over Ni Insulator Material PA6T+30 GF(UL94-V0) Mounting Type Through Hole Terminati...
... Insulation Resistance 1000 MΩ Min Operation Temperature -40℃ to 105℃ Contact Material Coppy Alloy Contact Plating Au or Sn Over Ni Insulator Material PA6T+30 GF(UL94-V0) Mounting Type Through Hole Terminati...
... Insulation Resistance 1000 MΩ Min Operation Temperature -40℃ to 105℃ Contact Material Coppy Alloy Contact Plating Au or Sn Over Ni Insulator Material PA6T+30 GF(UL94-V0) Mounting Type Through Hole Terminati...