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Casting Process Mould Release Agent For APG Mold With Dry Type Transformers MOULD RELEASE FOR TRANSFORMER, CT PT Product Description: JT 6101 Organic Silicon Mould Release agent Features: Good release effect hi...
Medium High Voltage Transformer Flame Retardant Epoxy Resin 68928-70-1 TDS: JT 8600A Epoxy Resin 100 pbw JT 8600B Epoxy Hardener 80 pbw Liquid, Latent, Silica flour filled, hot-curing cast resin system. Special...
Liquid Flame Retardant Epoxy Resin For Medium High Voltage Insulation Switch Parts Product Description Bi-component Epoxy resin system/Liquid can be used to processes of Conventional casting process under vacuu...
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Product Description Property Bi-ecomponent Epoxy resin system/liquid can be used to processes of APG&Conventional casting process undervacuum.Excellent splitting resistance&heat resistance TG:70-90 Formulatio...
Product Description Property Bi-ecomponent Epoxy resin system/liquid can be used to processes of APG&Conventional casting process undervacuum.Excellent splitting resistance&heat resistance TG:70-90 Formulatio...
Product Description Property Bi-ecomponent Epoxy resin system/liquid can be used to processes of APG&Conventional casting process undervacuum.Excellent splitting resistance&heat resistance TG:80-100 Formulati...
Production details: Epoxy resin LE-8516 100 pbw Formulation Hardener LH-8516 100 pbw Filler Silica Flour 300-350 pbw Color paste LC series * 3 pbw LE-8516 is a modified saturated epoxy resin system. LH-8516 is ...
Product Description Bi-component alicyclic saturated structure epoxy resin system /liquid can be used to the processes of APG& Conventional casting process under vacuum,Excellent UV resistance &heat shock resis...
Product Description Property Bi-component Epoxy resin system/Liquid can be used to processes of APG&Conventional casting process under vacuum.Excellent splitting resistance&heat resistance TG:90-110. Epoxy resi...
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sl...
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sl...
1.0 W/m.K Thermally Conductive Encapsulant With Silicone For Power Dissipation Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sliver Grey Vi...
White Thermally Conductive Silicone Encapsulant Usage Temperature -40 ~ 150 Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sliver Grey Vi...
White Thermal Conductivity Silicone Encapsulating Low Viscosity For Transformer Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sliver Grey V...
Thermally Conductive Encapsulant Transparent Silicone Encapsulant For Solar Cells Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sliver Grey...
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sl...
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sl...
1.0 W/m.K Thermally Conductive Encapsulant With Silicone For Power Dissipation Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sliver Grey Vi...