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... layer 2 Material FR4 tg170 3 Board thick 1.8mm 4 Usage Communication 5 Laser drill size 0.1mm 6 Min line trace 0.075mm 7 Min space 0.075mm 8 Surface treatment ENIG 3u'' 9 Copper thick 105um 10 Solder mask t...
... Layer Insulation Layer Thickness 0.075mm--5.00mm Min.hole size 0.1mm (drilling hole) Max. Board size 1200mm*600mm Out Layer Copper Thickness 18um--350um Inner Layer Copper Thickness 17um--175um NPTH Hole To...
...Board Mobile Charger PCBA Motherboard TS16949 Technical capabilities: Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00m...
... lead free,Immersion Gold/Tin/Silver,OSP,gold plating/finger,Carbon ink,Peelable mask 9 Copper thickness 18um-280um(0.5OZ-8OZ)...
...,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline Tolerance +0.10mm Thickness Tolerance(t≥0.8mm) ±8% Thickness Tolerance(t<0.8mm) ±10% Insulation Layer Thickness 0.075mm--5.00mm Minimum Line 0.075mm Minimum Space 0...
...Board with Blind Buried Holes Technical & Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 60...
...Board 1 OZ CU Main Features: 1 A 14 layer printed circuit board with finish board thickness at 1.6mm. 2 Solder mask in green color and white silkscreen. 3 Exposed copper pad surface to do immersion gold trea...
... layer 2 Material FR4 tg170 3 Board thick 1.8mm 4 Usage Communication 5 Laser drill size 0.1mm 6 Min line trace 0.075mm 7 Min space 0.075mm 8 Surface treatment ENIG 3u'' 9 Copper thick 105um 10 Solder mask t...
... Layer Insulation Layer Thickness 0.075mm--5.00mm Min.hole size 0.1mm (drilling hole) Max. Board size 1200mm*600mm Out Layer Copper Thickness 18um--350um Inner Layer Copper Thickness 17um--175um NPTH Hole To...
...,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline Tolerance +0.10mm Thickness Tolerance(t≥0.8mm) ±8% Thickness Tolerance(t<0.8mm) ±10% Insulation Layer Thickness 0.075mm--5.00mm Minimum Line 0.075mm Minimum Space 0...
...Board with Blind Buried Holes Technical & Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 60...
... lead free,Immersion Gold/Tin/Silver,OSP,gold plating/finger,Carbon ink,Peelable mask 9 Copper thickness 18um-280um(0.5OZ-8OZ)...
...Board Mobile Charger PCBA Motherboard TS16949 Technical capabilities: Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00m...
...Board 1 OZ CU Main Features: 1 A 14 layer printed circuit board with finish board thickness at 1.6mm. 2 Solder mask in green color and white silkscreen. 3 Exposed copper pad surface to do immersion gold trea...
...Thick Electronic PCBA with 1oz Copper 0.2mm Min Hole Size Product Description: Multilayer PCB Circuit Board is a type of Printed Circuit Board (PCB) which is suitable for SMT manufacture. It is made of high ...