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.... The aluminum plate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. 25 boards are packed separately. 1.2 Features and benifits A. SMT pr...
...PCB for the application of Led Lighting with bowl- dented holes. It's at 1.6 mm thick with 1 W/MK thermal conductivity. The aluminum plate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated...
...PCB for the application of a filter electric circuit. It's a single layer MCPCB board at 1.6 mm thick with 2 W/MK thermal conductivity. The aluminum plate is from ITEQ, Solder mask and silkscreen from Taiyo....
... aluminum plate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. 25 panels are packed for shipment. 1.2 Features and benifits A. SMT proce...
...PCB for the application of automotive ignitor. It's a single layer MCPCB board at 1.6 mm thick with 3 W/MK thermal conductivity. The aluminum plate is from ITEQ, Solder mask and silkscreen from Taiyo. It's f...
...PCB for the application of electronic regulator. It's a single layer MCPCB board at 2.0 mm thick with 2 W/MK thermal conductivity. The aluminum plate is from ITEQ, Solder mask and silkscreen from Taiyo. It's...
...Plating Fr4 HDI PCB Manufacturing 1. Product Descprition Item Specification Material High TG FR4 Layers 4-20 layers HDI HDI plus 1 or 2 Copper thickness 1/3-12OZ Minimum Via 0.1mm Surface treatment ENIG,OSP ...
... field Product field: communication station Number of layers: 42L high frequency mixed pressure super long board Plate thickness: 5.0mm; dielectric constant 4.20, Size: 852*420mm/1PCS Process structure:...
...low copper base PCB,electronic printed circuit board,prototype printed circuit board,small circuit board Product Description Product area: communication products Number of layers: 3LCopper-based PCB Plate th...
... 2.96mm; Size: 221*126mm/1PCS Process structure: Mitsui SablcM4+3M buried, minimum hole 0.30mm, copper thickness 1OZ, line width line spacing 3/......
...: 30*26mm / 1PCS Process structure: high frequency ISOLA, minimum hole 0.40mm, copper thickness 1OZ,impedance Ω±10%, resin plug hole + ......
... Plate thickness: 1.60mm Process structure: 3m+ buried resistance + FR-4TG170Impedance Ω ± 10%,line width line spacing 3/3mil, resin plug hole + ......
...PCB rigid flex printed circuit boards Product Description Product area: Motor Number of layers: 2L Plate thickness: 0.25mm Process structure: FR-4, line width line spacing 4/4mil, minimum hole 0.20mm, resin ...
...10mm,pcb printing Product Description 8 third-order HDI+ reinforcement,Shengyi FR-4+TG150+ black core material reinforcement, minimum hole 0.10mm,pcb printing Product area: LED Number of layers: 6 second-or...
... of second-order HDI Plate thickness: 12.0mm Process structure: FR-4TG180, RCCPP, thermal conductivity 10W, green oil, minimum hole 0.35mm, minimum line width 4/......
...Flame Retardant Properties V0 Processing Technology Delay Pressure Foil Base Material Copper Insulation Materials Epoxy Resin Brand XCE Trademark XCE Transport Package Vacuum Packing Specification / Origin C...
Item Specification 1 Numbr of Layer 1-18Layers 2 Material FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate 3 Surface Finish HASL(LF), Gold plating, Electroless nickel immersion gold...
... (18 um-385 um) Copper Plating Hole 18-40 um Impedance Control ±10% Warp&Twist 0.70% Peelable 0.012"(0.3mm)-0.02’(0.5mm) ......