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...PCB Machine Optional Green UV Laser Source Laser PCB Cutting Equipment Features: 1. Lasers make clean, burr-free and precise cuts against the edge of circuits and other important components—improving overall...
... help protect copper traces and pads on the PCB surface from corrosion and other forms of degradation. A 6-layer PCB is a multi-layer PCB consisting of six layers of substrate material and copper traces. Mul...
Material FR4 Metal Based Pcb PCB UL ROHS ISO9001 SMT PCB Board Fabrication We Suntek are highly experienced in providing PCBs covering substrate materials such as FR4(High TG), Teflon, Rogers, Ceramic and Alumi...
Metal Core Substrate Custom PCB Boards With Heavy Copper 4OZ Thickness Parameter: Copper thickness 0.5 OZ to 7.0 OZ Copper thickness in hole >25.0 um (>1mil) Size Max. Board Size: 23 25 (580mm900mm) Min. Dri...
...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...
...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...
...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...
...: FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and...
...: FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and...
...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...
...PCB Copper Clad Laminate 1.6mm Thickness 1oz Copper Quick detail: Origin:China Special: FR4 Material Layer:6 Thickness:1.6mm Surface: ENIG Hole:0.5 Specification: FR - 4 epoxy glass fiber cloth substrate, ba...
High Frequency multilayer pcb fabrication process With Rogers 3210 Substrate Detailed Product Description Rogers 3210 High frequency Laminate in stock Model: XCEH Origin: Shenzhen Size: 8*9cm Layer 2 ......
Half Hole Technology Rogers PCB Circuit Boards With High Frequency Substrate RT/duroid® 5880LZ materials have the lowest Dk for a copper clad laminate available in the market today. Because of its low dielectri...
...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...
...: Electronic Scale PCB With 0.8mm Thickness 94V0 Electronic Board Green Soldermask White Silkscreen, FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fibe...
...: FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and...
Dual Layer Flexible PCB Built on PI Substrate With Black Solder Mask and Immersion Gold for GPS Navigation (FPC’s are custom-made products, the picture and parameters shown are just for reference) ......
PCBA packaging method: Anti-static bag + Anti-static bubble wrap + Good quality carton box Product Description Product area: military products Product structure: 24 layers HDI third-order, FR-4, TG170, inner an...
PCBA packaging method: Anti-static bag + Anti-static bubble wrap + Good quality carton box Product Description Product area: military products Product structure: 14 layers HDI third-order, FR-4, TG170, inner an...
Customized Home Appliance Pcb Sensor Substrate Management System Printed Circuit Board Patch Manufacturing #detail_decorate_root .magic-0{width:750px}#detail_decorate_root .magic-1{overflow:hidden;width:......