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... 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Parallel and Serial connection of LED design, Lower Forwa...
... Module 400W Stage Moving-head LED Light Engine Products’ Features: 1, Small LES, 5W/mm² , High Power and high light density for spot lighting,far distance projection illumination 2, The latest Eutectic Flip...
ST04 Temperature Transmitter Overview The intelligent temperature transmitter module can be configured with PC, and can receive thermocouples or thermoelectric letters.The number of input can be set and the the...
... 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Parallel and Serial connection of LED design, Lower Forwa...
...3200K CRI95 450W LED Module Products’ Features: 1, Small LES, 5W/mm² , High Power and high light density for spot lighting,far distance projection illumination 2, The latest Eutectic Flip-chip bonding with C...
... Flux Density LED Emitter 42V LED Module Features: 1, Small LES, 5W/mm² , high light density 2, High light efficiency 75lm/W 3, Eutectic packages technique, fast heat-conductivity; 4, Thermoelectric isolatio...
... 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Parallel and Serial connection of LED design, Lower Forwa...
90W 150W White LED Modules with High lumen Small LES Features & Advangates: 1, Small LES, 5W/mm² 2, Eutectic packages, Thermoelectric management, fast heat-conductivity 3, Special Parallel and Serial connection...
Multi Chip Eutectic White LED Modules 90W 150W 250W with High Lumen Density Features: 1, Small LES, 5W/mm 2, Eutectic packages, Thermoelectric management, fast heat-conductivity 3, Special Parallel and Serial ...
Fiber Optics White 12V LED Module 150W 3600 - 4000lm , Small LES 5W/mm² Features & Advangates: 1, Small LES, 5W/mm² 2, Eutectic packages, Thermoelectric management, fast heat-conductivity 3, Special Parallel an...
RGBW Multi Chip Led 300Watt Small LES , Washlight Cree Chips LED Module Products’ Features: 1, Small LES, 5W/mm² ; 2, Eutectic Flip-chip bonding, Thermoelectric solution, fast heat-conductivity 3, Special Paral...
...LED Module, 250W RGBW LED Light Engines Products’ Features: 1, Small LES, 5W/mm² , High Power and high light density for spot lighting,far distance projection illumination 2, The latest Eutectic Flip-chip bo...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...