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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
...Light Box with Phone Holder for YouTube Video, Dimmable Desk/Stand LED Ring Light for Photography, Shooting, Stream, Tiktok 【Fold After Use】Say goodbye to the messy desk! Just put the accessories into the ba...
... in set lighting (fill or main) as a high quality softened light source with its high pwer high output and unmatchable performance. The lighting balloons are able to create amazing lighting that a convention...
...h its high pwer high output and unmatchable performance. The lighting balloons are able to create amazing lighting that a conventional lighting could unsatisfactorily to deliver. Its standard range has a lig...
... Video & Film Lighting Ultra Brightness Ra95 Warm + Cool White CRI>95Ra Dual Color 300W+300W COB LED Chip HuanYu Dream's Dual Color COB LED Chip has been widely used for various photography lighting, fil...
50% Light Transmission Polycarbonate Sheet Operating Temperature -40 To +120 Customized Width *, *::before, *::after {box-sizing: border-box; } * {margin: 0; } html, body {height: 100%; } body {line-height: 1...
2.5kg/m2 Light Diffusing Polycarbonate Sheet Customized Thickness polycarbonate diamond sheet embossed *, *::before, *::after {box-sizing: border-box; } * {margin: 0; } html, body {height: 100%; } body {line-he...
...Photography Studio Customized Artemis Lighting Balloon The Artemis Lighting Balloon is a versatile lighting solution commonly used in film and TV production, as well as photography studios. It offers an exce...
Photography lights CHIPS 180W 620nm/460nm/520nm/2700K/6500K 140LM/W 14-20A 35-40V With Outdoor Lighting LED CHIP Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitr...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...