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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
...Light Box Aluminum Frame Fabric Light Box Advertisement Signage Display Product Name: Stand Light Box Light Source: LED Frame Material: Aluminum Size: Customized Printing Material: PVC Soft Film Life Span: 5...
Super Bright 5050 COB LED Chip 500W White Description HuanYu dream 5050 COB LED chip 500W, high CRI 98Ra500W COB LED With Ultra Bright Daylight 5600K, reliable and stable performance, COB5050 LED is applied for...
2828 Dual colors High CRI COB LED for Spot Light Ceiling light High-performance dual colors COB LED chip delivering exceptional luminous output with wide color temperature range (2700-6500K) and RoHS compliance...
72-74V Dual Color COB LED Customized 300W 4055 Dual Color COB LED White 2600K+6500K COB LED CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDua...
... balloon lights are uniquely designed to elevate your filming and photography experience. Various shapes, light source and powers are available. Can be customized based on clients' needs. Our customized ball...
... effect of light on the photographic film, which often makes outdoor photographs hazy and indistinct. UV lens serves to protect the lens from scratching, dirt, and dust. UV filter DOES NOT cut down (98% effe...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...