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Pin Grid Array

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Total 1522 products for pin grid array Manufacture & Suppliers

Microcontroller MCU MIMX8ML6CVNKZAB i.MX 8M Plus Quad Microprocessor Chip 548LFBGA

...MIMX8ML6CVNKZAB MIMX8ML6CVNKZAB is i.MX 8M Plus Quad Microprocessor Chip, low profile, fine-pitch, ball grid array package, 548 terminals, 0.5 mm pitch. Specification Of MIMX8ML6CVNKZAB Part Number: MIMX8ML6...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Microcontroller MCU MIMX8MN5DVPIZAA TBGA306 i.MX 8M Nano UltraLite Quad 4 Core

... MIMX8MN5DVPIZAA is i.MX 8M Nano UltraLite Quad Microprocessors IC, thin ball grid array package, 306 terminals, the package is 306-TFBGA (11x11). Specification Of MIMX8MN5DVPIZAA Part Number MIMX8MN5DVPIZAA...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Microcontroller MCU 1.4GHz MIMX8MN5CVPIZAA TBGA306 4 Core Microprocessors IC

... MCU 1.4GHz MIMX8MN5CVPIZAA TBGA306 4 Core Microprocessors IC Product Description Of MIMX8MN5CVPIZAA MIMX8MN5CVPIZAA TBGA306, thin ball grid array package, 306 terminals, i.MX 8M Nano UltraLite Quad Applica...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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i.MX 8M Nano SoloLite MIMX8MN1DVTJZAA Microcontroller MCU 1 Core 1.5GHz LFBGA486

...-time integrity checker (RTIC), i.MX 8M Nano SoloLite. The package is LFBGA486, low profile fine-pitch ball grid array. Specification Of MIMX8MN1DVTJZAA Part Number MIMX8MN1DVTJZAA Video/Display features MIP...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Microcontroller MCU MCIMX7S3DVK08SD i.MX 7Solo Processors TFBGA488 1 Core

...®-A7 and Cortex-M4 Cores. Package is TFBGA488, plastic, thin fine-pitch ball grid array. Specification Of MCIMX7S3DVK08SD Part Number MCIMX7S3DVK08SD USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage - I/...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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800MHz Microcontroller MCU MCIMX7S5EVM08SD 1 Core Microprocessor Chip 541LFBGA

... array; 541 balls; 0.75 mm pitch; 19 mm x 19 mm x 1.33 mm body. Specification Of MCIMX7S5EVM08SD Part Number: ......

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Microprocessors Chip MCIMX7U3CVP06SD LFBGA393 Low Power Microcontroller MCU

...-power. The package is LFBGA393, low profile fine-pitch ball grid array. Specification Of MCIMX7U3CVP06SD Part Number: MCIMX7U3CVP06SD Number Of Cores/Bus Width: 1 Core, 32-Bit Operating Frequency(Max): 650M...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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1.5GHz LS1027AXE7PQA Dual Core 64Bit Microprocessors Chip 448FBGA Circuit Chip

... enabled. Package is FBGA448, fine-pitch ball grid array package. Product Attributes Of LS1027AXE7PQA Part Number: LS1027AXE7PQA Qualification Tier: Industrial Core Type Arm: Cortex-A72 Number Of ......

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Microprocessors IC LS1017ASN7PQA FBGA448 Single Core Processors Chip 1.5GHz

... Of LS1017ASN7PQA LS1017ASN7PQA is Single Core 1.5GHz Processors Chip, FBGA448, fine-pitch ball grid array package. Two high-speed USB 2.0/3.0 controllers with integrated PHY. Product Attributes Of LS1017AS...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Electronic Pcba Circuit Board Green Silk Turnkey PCB Assembly ENIG 2U Immersion Gold IPC Class II/ III

..., Flex, Rigid-flex, MPCB,HDI bare board ※ Surface Mount Assembly (SMT) ※ Through Hole Technology (THT) ※ Ball Grid Array (BGA) assembly and inspection ※ Wire harness & cable assembly ※ Box Build and Final as...

Suntek Electronics Co., Ltd.
Hunan,China

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Prototype Pcb Components Assembly 1.6mm 2layer Printed Circuit Board Assembly Lead Free Rohs

...Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly 6) Box Build and Final assembly 7) Lead-......

Suntek Electronics Co., Ltd.
Hunan,China

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0.8mm Smd Pcb Assembly Manufacturer SMT THT

..., Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly 6) Box ...

Suntek Electronics Co., Ltd.
Hunan,China

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Smt Pcba Quick Turn Pcb Fabrication Thick Copper 3OZ

..., Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly 6) Box ...

Suntek Electronics Co., Ltd.
Hunan,China

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Soar New Energy PCB Manufacturing And Assembly Services PCBA

... :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly. 7. Test in-house(ICT/FT High-pot/E-test etc) 8. A team...

Suntek Electronics Co., Ltd.
Hunan,China

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Electronic Circuit Board Assembly Electric Power PCBA Board Assembly SMT

... :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly....

Suntek Electronics Co., Ltd.
Hunan,China

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Silicone Wiring Harness Electronic Cable Assembly Harness PVC FEP TPU PP XLPE LSZH

..., Flex, Rigid-flex, MPCB,HDI bare board ※ Surface Mount Assembly (SMT) ※ Through Hole Technology (THT) ※ Ball Grid Array (BGA) assembly and inspection ※ Wire harness & cable assembly ※ Box Build and Final as...

Suntek Electronics Co., Ltd.
Hunan,China

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Custom Cable Harness Assembly No Quantity Limited ROSH UL CE

... (THT) ※ Ball Grid Array (BGA) assembly and inspection ※ Wire harness & cable assembly ※ Box Build and Final assembly ※ Lead-Free,RoHS,Reach ......

Suntek Electronics Co., Ltd.
Hunan,China

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Rigid PCB Board Type PCBA Circuit Board Assembly SMT THT Turnkey Service in China and Cambodia

... :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly. 7. Test in-house(ICT/FT High-pot/E-test etc) 8. A team of En...

Suntek Electronics Co., Ltd.
Hunan,China

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64GB EMMC 5.1 Storage Chip - High-Speed Solution For Embedded Systems

... speeds of up to 400MB/s, making it ideal for applications requiring fast data access and reliable storage. Featuring a compact BGA (Ball Grid Array...

China Chips Star Semiconductor Co., Ltd.
China

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128GB 256GB eMMC for Tablet PC AR VR Smartphone Read Speed Up to 330MB/s OEM/ODM

... the design and connection process. 2. Packaging form: Usually provided in BGA (Ball Grid Array) packaging form, with a set of spherical solder balls at the bottom for connecting the package to the printed c...

China Chips Star Semiconductor Co., Ltd.
China

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