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... with A Weight of 200-300G/m² Wanli® EVA hot melt adhesive C-22 for book cover bonding is a ethylene-vinyl acetate copolymer with 100% solid content. C-22 is specifically developed for book wireless binding....
...h Paper Weight ≤300G/m² Wanli® EVA hot melt adhesive C-23 for book cover bonding is a ethylene-vinyl acetate copolymer with 100% solid content. C-23 is specifically developed for book wireless binding. C-23 ...
... Production Application Wanli® EVA hot melt adhesive KB-1H for carton and folding box production is a ethylene-vinyl acetate copolymer with 100% solid content. KB-1H is specifically developed for carton box ...
...Paper Weight ≤157G/m² Wanli® EVA hot melt adhesive 8219 for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid content. 8219 is specifically developed for book wireless binding. 8219 is ...
...Book Binding in Graphic Shop Wanli® EVA hot melt adhesive 8221 for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid content. 8221 is specifically developed for book wireless binding. 8...
...Book Back Binding of Paper Weight ≤157G/m² Wanli® EVA hot melt adhesive 8225 for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid content. 8225 is developed for book wireless binding. ...
... at Paper Weight of 50-60G/m² Wanli® EVA hot melt adhesive KG-6D for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid content. KG-6D is developed for book wireless binding. KG-6D is fe...
...bonding is a ethylene-vinyl acetate copolymer with 100% solid content. KG-7D is specifically developed for book wireless binding. KG-7D is featured high bonding ......
...±1000mpa·s (160℃) for Book Back Binding Wanli® EVA hot melt adhesive KG-7G for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid content. KG-7G is specifically developed for book wirele...
... with Paper Weight ≤105G/m² Wanli® EVA hot melt adhesive KG-8 for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid content. KG-8 is specifically developed for book wireless binding. KG...
...Book Cover Bonding Application Wanli® EVA hotmelt adhesive 8430 for book cover bonding is a ethylene-vinyl acetate copolymer with 100% solid content. 8430 is specifically developed for book wireless binding....
Factory Direct High Quality WANLI KG-10 Book Cover Binding White Solid Bulk EVA Hot Melt Adhesive Wanli EVA hot melt adhesive KG-10 for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid ...
... Wanli® EVA hot melt adhesive KB-1HA for carton and folding box production is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for automatic carton box packaging. It i...
... Sealant Bonding Wanli® EVA hot melt adhesive KB-1HA for carton and folding box production is a ethylene-vinyl acetate copolymer with 100% solid content. KB-1HA is specifically developed for automatic carton...
...hot melt adhesive JF-108 for edge bonding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for bonding of chip board to various kinds of edge band. It is featured h...
...h High Bonding Strength Wanli® EVA hot melt adhesive JF-108 for edge bonding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for bonding of chip board to various k...
... Bonding with Lower Cost Wanli® EVA hot melt adhesive JF-108 for edge bonding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for bonding of chip board to various ...
...Materials Wanli® EVA hot melt adhesive JF-202 for 3D lamination & edgebanding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for edgebanding bonding of chip board...
... adhesive EVA-JF-202 for wrapping & edgebanding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for wrapping bonding of chip board to various kinds of surface mate...
... Wanli® EVA hot melt adhesive JF-202 for 3D lamination & edgebanding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for 3D lamination bonding of chip board to var...