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...Thermally Conductive Sheet Pads Silicon Thermal Pad For Cooling Components To The Chassis Of Frame Product descriptions TlF500-20-11U is an extremely soft gap filling material rated at a thermal conductivity...
...Thermal Conductivity 8.0W/MK Thermal Gap Filler Pad For CPU And GPU Processors Product descriptions TS-TIF®100C 6530-11 series is a silicone-based thermal material designed to fill the gaps between heat-gene...
...Thermal Conductive Pad Gap Filling Materials Silicone Thermal Pad For LED CPU Laptop Product descriptions TlFTM100-06S Series is a silicone based, thermally conductive gap pad. Its unreinforced construction ...
...Thermal Conductivity Resistant Flame-Retardant Insulation 7.5W/MK Silicone Thermal Pad Product descriptions TlF500-75-11U Series is a silicone based, thermally conductive gap pad. Its unreinforced constructi...
...Thermal Pad With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling Products description Ziitek TIF™100-20-11PSA series is a silicone based, thermally conductive gap pad. Its unreinfo...
Naturally tacky blue Good Thermal Conductive pad For CPU Heat Dissipation 1.5 W/mK RoHS compliant TIF100-05E 35 Shore 00 The TIF100-05E Series thermally conductive interface materials are applied to fill the ai...
LCD TV Silicone Rubber Thermal Conductive Pad Cooling High Adhesive 2W/mK The TIF100-20-10F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the...
TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK The TIF100-20-05S thermally conductive interface materials are applied to fill the air gaps between ...
Pink LCD Heatsink Thermal Conductive Pad 1.5W/mK ,silicone rubber sheet TIF100-15-14S, 60 Shore 00 The TIF100-15-14S Series thermally conductive interface materials are applied to fill the air gaps between the ...
UL recognized Thermal Conductive Pad, grey Silicone sheet 45 Shore 00 1.5W/mK for High speed mass storage drives The TIF100-15-02S Series thermally conductive interface materials are applied to fill the air gap...
Grey Cooling Electronic Ultra Soft Thermal Conductive Pad , silicone rubber sheet 1.5w/mk with 60 shore00 hardness The TIF120-15-02F thermally conductive interface materials are applied to fill the air gaps bet...
Ultra Soft Low Thermal Conductivity Materials PAD Light Green 3.5 MHz Dielectric Constant The TIF120-20-07U thermally conductive interface materials are applied to fill the air gaps between the heating elements...
Soft Safe Simple To Apply Anti-Static Thermal Conductive Silicone Pads For Ssd Cpu Gpu Led Ic Chipset Cooling The TIF100-15-11S thermally conductive interface materials are applied to fill the air gaps between ...
2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling The TIF100-15-07E thermally conductive interface materials are applied to fill the air gaps between the heating elements and...
Pink 3.0W/mK Flexibility Thermal Conductive Pad TIF150-30-49U for Heat Housing at LED-lit 30 shore00, -40 to 160 The TIF150-30-49U thermally conductive interface materials are applied to fill the air gaps betw...
Naturally Tacky Rubber Gap Filler Thermally Conductive Interface Materials 3.0 W/MK The TIF150-30-05S thermally conductive interface materials are applied to fill the air gaps between the heating elements and t...
Thermal Conductive Pad 3.0 W/mK Heatsink silicone rubber Pad TIF100-30-49U Advantage Ziitek has independent R&D team. This team is experience, rigorous and pragmatic. They undertake the core research and develo...
3.0 W/MK Silicone Thermal Conductive Pad For Telecommunication Hardware -50 to 200 The TIF150-30-19S thermally conductive interface materials are applied to fill the air gaps between the heating elements and t...
Non Toxic 3.0 g/cc Thermal conductive Pad TIF100-30-11S 3.0W / mK For Micro Heat Pipe 45 shore00 The TIF100-30-11S Series thermally conductive interface materials are applied to fill the air gaps between the he...
CPU Heat Dissipation TIF100-30-05S blue High Thermal Conductive Pad 3.0 g / cc Specific Gravity 3.0W/mK The TIF100-30-05S thermally conductive interface materials are applied to fill the air gaps between the he...